25 news items tagged 0.18-micron
Qualcomm seeking to shift orders from SMIC, says report
Monday 21 September 2020Executives at Qualcomm have paid visits to Taiwan-based pure-play foundries for the purpose of securing capacity support if deliveries from China's Semiconductor Manufacturing International...
Hua Hong starts volume production for second-generation 0.18-micron 5V/40V BCD process platform
Monday 15 October 2018China-based pure-play foundry Hua Hong Semiconductor has announced that its second-generation 0.18-micron 5V/40V BCD process platform has been successfully mass-produced.
Allegro, UMC sign long-term supply deal
Thursday 2 August 2018Allegro MicroSystems, which develops high-performance power and sensing semiconductors, has signed a long-term deal with United Microelectronics (UMC) under which UMC will remain...
SMIC 3Q17 profits fall
Wednesday 15 November 2017China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has announced revenues of US$769.7 million in the third quarter of 2017, up 2.5% sequentially but down...
ACTT complete IoT solutions available on SMIC 55nm eFlash platform
Friday 13 October 2017Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...
Faraday MFP ASIC shipments rise at CAGR of 38%
Thursday 22 June 2017Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...
UMC qualifies 0.18-micron BCD process for auto chips
Monday 1 August 2016United Microelectronics (UMC) has verified on silicon its 0.18-micron Bipolar CMOS DMOS (BCD) process for the most stringent AEC Q100 grade-0 automotive chips, according to the foundry...
NewEdge Technology shipping wireless charging ICs in volume
Tuesday 7 April 2015China-based NewEdge Technology has started shipping its wireless charging ICs in volume. The chips are being manufacturing using TSMC's 0.18-micron technology, according to industry...
Hua Hong, eMemory partner to develop MCUs for IoT
Tuesday 24 March 2015Hua Hong Semiconductor and eMemory Technology have jointly announced they will further strengthen their strategic partnership and work together in the field of microcontrollers (MCU),...
More IC vendors seeking wafer production capacity at foundry houses other than TSMC
Tuesday 12 August 2014More fabless IC design houses are seeking wafer production capacity at Samsung Electronics, Globalfoundries, United Microelectronics Corporation (UMC) and Semiconductor Manufacturing...
Silterra 0.18-micron embedded flash technology enters mass production
Tuesday 16 October 2012Malaysia-based IC foundry Silterra has announced the production release of its 0.18-micron embedded flash technology, dubbed C18E. Silterra has licensed SuperFlash technology from...
UMC develops 0.18-micron MTP technology
Wednesday 14 September 2011United Microelectronics (UMC) has announced that under a joint development with IC design house Yield Microelectronics (YMC), it has developed a new 0.18-micron multiple-time programmable...
UMC launches 1.8-5V embedded EEPROM processes
Thursday 1 September 2011United Microelectronics Corporation (UMC) has announced breakthroughs in its development of embedded EEPROM (eEEPROM) process technologies, which deliver an I/O voltage range of 1.8V-5V...
Dongbu HiTek launches 180nm processes for analog, power and mixed-signal chips
Tuesday 30 August 2011Dongbu HiTek, a South Korea-based contract chipmaker, has announced the availability of two new specialized process technologies at the 180nm node for implementing advanced analog,...
X-Fab, Micronas sign foundry deal
Thursday 25 August 2011Analog/mixed-signal IC foundry X-Fab Silicon Foundries and Micronas, a supplier of application-focused sensor and IC system solutions for automotive electronics, have announced the...
eMemory, Maxchip work on consumer ICs built using 0.18-micron OTP process
Monday 22 August 2011Taiwan-based eMemory Technology, a provider of IP for logic embedded non-volatile memory (NVM), has announced that it is working with 8-inch foundry Maxchip Electronics to provide...
UMC to terminate merger deal with Hejian
Friday 19 November 2010United Microelectronics Corporation's (UMC) board of directors has decided to terminate the company's merger agreement with Hejian Technology, according to the Taiwan-based contract...
VIS 2Q10 results beat guidance; raises capex
Tuesday 17 August 2010Vanguard International Semiconductor (VIS) has announced that shipments, utilization rates and gross margins in the second quarter beat its guidance. The specialty IC foundry expects...
eMemory develops 0.18-micron 3.3V OTP solution
Thursday 8 July 2010Non-volatile memory IP developer eMemory Technology has announced the availability of a 0.18-micron 3.3V one-time-programmable (OTP) solution, developed using the company's proprietary...
TSMC announces automotive-qualified 0.25-micron OTP IP
Wednesday 30 June 2010Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its 0.25-micron one-time programmable (OTP) IP now meets Automotive Electronics Council (AEC) standard AEC-Q100...
TSMC announces 0.18-micron automotive embedded flash IP
Thursday 27 May 2010Taiwan Semiconductor Manufacturing Company (TSMC) has announced its 0.18-micron automotive embedded flash IP that passed AEC-Q100 product qualification requirements for a wide range...
CSMC inks licensing deal with IBM for 0.18-micron RF CMOS process
Wednesday 21 October 2009CSMC Technologies, a China-based specialty foundry provider, has signed an agreement with IBM to license its proprietary 0.18-micron radio frequency (RF) CMOS process. The process...
Taiwan government denies report of relaxed rules on fab investment in China
Thursday 30 July 2009Officials from the Industrial Development Bureau (IDB) under Taiwan's Economics Ministry have denied a recent Chinese-language Economic Daily News (EDN) report that indicated...
SMIC and Chingis announce availability of 0.18-micron embedded flash process and IP
Tuesday 2 June 2009Semiconductor Manufacturing International Corporation (SMIC) and Chingis Technology, a fabless chipmaker of embedded non-volatile memory (NVM) solutions, have announced the availability...
TSMC introduces 0.18-micron made embedded flash process
Wednesday 1 April 2009Taiwan Semiconductor Manufacturing Company (TSMC) has recently announced that it has qualified its new 0.18-micron embedded flash (embFlash) process technology family that targets...