Press releases

Fibocom FG360

Fibocom to be first in providing engineering samples of 5G module based on MediaTek chipset platform

Friday 15 January 2021

Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions. FG360-EAU will be launched...

5G opporutnities: Q&A with LitePoint president Brad Robbins

Thursday 14 January 2021

LitePoint, a US-based wireless test solution provider, offers turnkey over-the-air test solutions from development to production, combined with software automation...

MSI unveils innovations in gaming hardware and computing at MSI Premiere 2021: Tech for the Future

Thursday 14 January 2021

MSI, a world leader in gaming hardware and computing solutions, unveils an innovative lineup of gaming, creator and business products at its virtual launch event,...

Gowin embeds Winbond 64Mb HyperRAM to GoAI 2.0

Wednesday 13 January 2021

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that FPGA manufacturer Gowin Semiconductor has embedded...

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