On September 23, the 5th Global Memory Innovation Forum (GMIF2026) will convene at the Renaissance Shenzhen Bay Hotel. Co-hosted by the Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, GMIF2026, themed "The Future Built on AI Memory and Storage," will offer a comprehensive perspective on the memory and storage value chain through the lens of the token economy. The event brings together leading enterprises, distinguished technical experts, and industry leaders from across the global storage and semiconductor supply chain to examine emerging trends, evolving demands, and new avenues of collaboration in the AI era.The summit will feature executives and technical experts from more than 18 leading global companies and academic institutions, specifically including Morgan Stanley, School of Integrated Circuits at Peking University, Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Arm, BIWIN, Lenovo, Numbers Law, SYNCORE, NEXWISE, Infplane, Paratera, OKN Technology, Dify, Genstoraige, and among others. Speakers will address memory and storage technology evolution, market strategy, practical AI application deployment, industry ecosystem collaboration, and capital value creation, with the aim of advancing the token economy and supporting the development of AI infrastructure.In the exhibition area, 39+ exhibitors will bring 300+ innovations spanning the full memory & storage and semiconductor stack—wafer IDMs, controller makers, solution providers,OSATs, equipment vendors, platform companies, AI compute and server makers, and end-application companies. It’s a rare chance to meet the entire memory & storage landscape in one place, get a read on where AI memory & storage tech is headed, and strike up conversations that could turn into real deals.Register now to lock in your spot at GMIF 2026—get ahead of the trends in the AI memory and storage industry, meet the people shaping the industry, and open doors to your next opportunity.SMIA's Rixin Sun & Morgan Stanley's Daniel Yen headline GMIF 2026 agenda. Credit: GMIFSamsung, PKU, SanDisk & Solidigm experts to speak at GMIF 2026 morning. Credit: GMIFArm, Silicon Motion, Biwin & Lenovo experts highlight GMIF 2026. Credit: GMIFNumbers Law, Syncore, Nexwise & Infplane experts join GMIF 2026. Credit: GMIFParatera, OKN, Dify & Genstorage experts conclude GMIF 2026. Credit: GMIF

Syensqo, a leading global supplier of advanced materials and chemical solutions, showcased its advanced materials portfolio for next-generation semiconductor manufacturing, with a particular focus on its latest Tecnoflon FFKM innovations, at SEMICON Taiwan 2026.Syensqo demonstrated how its materials address critical challenges across the semiconductor manufacturing ecosystem—from fab infrastructure and equipment protection to critical components and more circular, high-purity manufacturing. As AI drives demand for more powerful and complex chips, manufacturers face increasingly stringent requirements for purity, chemical and plasma resistance, thermal performance and contamination control—all critical to process reliability, uptime and yield.Syensqo highlighted key solutions from its semiconductor portfolioHigh-purity Solef PVDF for fab infrastructure: Supporting ultra-pure water systems with high purity and chemical stability.Halar ECTFE for process equipment protection: Providing chemical and corrosion resistance for critical tools, duct and exhaust systems.Tecnoflon FFKM NFS for critical process components: High-performance sealing materials for aggressive chemistries, plasma exposure and extreme temperatures.KetaSpire R-PEEK for circularity and high-purity manufacturing: Reducing virgin feedstock requirements while maintaining the performance and purity required for semiconductor equipment components.Leading with performance: the next generation of Tecnoflon FFKMSyensqo's expanded Tecnoflon FFKM NFS portfolio introduces new grades designed to extend performance in critical semiconductor applications. These advances are delivered using Syensqo's proprietary non-fluorosurfactant (NFS) technology. Tecnoflon FFKM NFS is the first FFKM on the market manufactured entirely without fluorosurfactants, combining enhanced performance with a more responsible manufacturing approach.The portfolio includes:Dry process grades: Robust sealing performance and broad chemical compatibility.Plasma resistant grade: Enhanced durability in fluorine, oxygen and hydrogen plasma environments.High-temperature grade: Reliable sealing performance at continuous operating temperatures of up to 320°C.Together, these advances can help extend seal life, reduce particle-generation risk and support fab productivity and yield.Looking ahead, Syensqo is also using generative AI to accelerate the development of next-generation materials for semiconductor manufacturing, helping researchers identify solutions that combine higher performance with improved sustainability."AI is accelerating the semiconductor technology roadmap and raising material performance requirements throughout the fab," says Wolf Sanner, Vice President of Electronics & Industrial at Syensqo Specialty Polymers GBU. "Our latest Tecnoflon FFKM innovations demonstrate how higher performance and more responsible manufacturing can advance together, while AI-enabled materials discovery is helping us develop the materials semiconductor manufacturers will need next."Syensqo at SEMICON Taiwan 2026: Booth Highlights.

SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of its corporate venture capital (CVC) brand, "SK hynix Ventures," aimed at expanding strategic partnerships within the global AI ecosystem and securing future innovative technologies.To mark the occasion, SK hynix held the inaugural "SK hynix Ventures Day" in Silicon Valley, where executives shared investment strategies with global venture capitalists and startup representatives while discussing future technological cooperation to respond to shifts in the AI industry.The event was attended by CEO Kwak Noh-Jung and key executive leadership, alongside representatives from global VC firms and executives from leading startups.Expanding Beyond Tech Sensing to Become a Strategic Partner in the AI EcosystemSince 2015, SK hynix has operated a CVC organization, pursuing both direct investments and indirect investments via fund commitments in promising early-stage startups within the semiconductor and emerging tech sectors. By investing in enterprises across key regions including the U.S., China, Israel, and Japan, the company has achieved returns exceeding twice its cumulative investment to date. Furthermore, it has accumulated a track record of discovering new supply chains and customers by pursuing technological collaborations—such as joint equipment development and Proof of Concept (PoC)—with portfolio companies.While past CVC activities focused primarily on "Tech Sensing" to explore future technology trends and "Path Finding" to discover new business opportunities, the company now plans to expand its CVC scope. Driven by recent advancements in AI technology and industry expansion, the role will evolve from simply discovering promising companies to leading collaborative innovation across the entire ecosystem.Discussing Cooperation in AI Computing, Data Centers, and Optical InterconnectThrough SK hynix Ventures, the company plans to broaden its investment scope from traditional semiconductors and emerging tech to the broader AI ecosystem. SK hynix aims to discover technologies and companies with high growth potential in core AI industry sectors—including AI computing, data centers, system software, and optical interconnect—and continually expand its CVC investments.Meanwhile, the event was attended by promising startups in the U.S. AI computing and data center technology sectors. These companies shared perspectives on future technological innovations, discussing the growing importance of computing, memory, and system software innovations driven by advanced AI models, alongside the performance and power efficiency of optical-based systems for AI data centers."Competitiveness in the AI era stems not just from rapidly securing innovative technologies, but from ecosystem capabilities where customers, partners, and startups create new value together," said Kwak Noh-Jung, CEO of SK hynix. "Through SK hynix Ventures, we will support the growth of promising companies and grow into a global partner that jointly designs the future of AI infrastructure based on strategic investments and technological cooperation."Credit: SK hynixCredit: SK hynix