Artificial intelligence (AI) is moving beyond a tool that simply answers questions and into the era of "agentic AI"—systems that make their own judgments and carry out tasks. A major event offering a comprehensive view of the latest currents in the global AI industry is once again coming to Seoul.DMK Global, COEX, and the Korea International Trade Association (KITA) announced that they will host "AI Summit Seoul & EXPO 2026" (AISE 2026) over three days, from August 19 (Wed) to 21 (Fri), at COEX in Seoul. The conference will take place in the Grand Ballroom, while a large-scale exhibition (EXPO) runs concurrently in Hall B. Since its inaugural edition in 2018, the industrial-AI-focused event—now in its ninth year—has established itself as an annual global AI event held in Seoul.The central theme this year is putting AI to real work, beyond mere adoption. As AI technology advances rapidly, companies now face a new challenge that goes beyond "whether to adopt AI" to "what authority to grant AI, and how to trust the results it produces." Generative AI has proven its value in producing answers and content; more recently, attention has turned to agent-based AI that independently makes decisions and takes action within enterprise workflows.Reflecting this shift, AISE 2026 has set its theme as "The Transformation Era: Beyond Adoption – Rise of Enterprise Agents." Rather than simply introducing technology, the event focuses on how AI agents are being applied in real business settings and how they are reshaping organizations and business models.The two-day conference, held in the COEX Grand Ballroom beginning August 19, is organized around six core themes: "AI Mega Trends," surveying fast-moving technology and market shifts; "AI Transformation," addressing changes to organizations and business models; "AI & Data," covering foundational challenges such as data labeling and MLOps; "Vertical Industry Use Cases," presenting real-world applications by sector; "AI + Robotics," exploring the convergence of AI and robotics; and the year's most talked-about theme, "Agent & Agentic AI."The global speaker lineup also stands out. Speakers include Steve Chien, a researcher at NASA's Jet Propulsion Laboratory (JPL) who studies autonomous AI capable of independent decision-making in space; Larry Heck, a Georgia Tech professor and leading authority on conversational AI; Maxim Afanasyev of Google Cloud; Hoifung Poon, a researcher at Microsoft Research focused on AI-driven scientific discovery; and Maxime Labonne, a researcher at Liquid AI and an expert in frontier small models.In addition, representatives from leading global technology and industry companies—including Genspark, Google DeepMind, Hyundai, DHL, Notion, IDEO, Mercedes-Benz, Seagate, Adobe, and ClickHouse—will take part to share proven use cases and technical insights across industries.Running alongside the conference, the exhibition (EXPO) takes place in COEX Hall B over three days, from August 19 to 21. Roughly double the size of last year's edition, it will feature more than 100 exhibiting companies and over 30 speech and workshop sessions. A key highlight is the opportunity to survey the entire AI value chain under one roof—from LLMs and generative AI to AI hardware and infrastructure (GPUs, NPUs, and more), robotics and autonomous technologies, and industry-specific solutions. Visitors can experience live demonstrations of products and solutions already in operation at exhibitor booths, across categories including Industry AI, Enterprise AI, generative AI, AI platforms and infrastructure, and physical AI and robotics.Exhibiting companies will run demos and consultations for decision-makers from Korea and abroad, and the program includes 1:1 business matching and networking parties connecting executives, developers, investors, and researchers. EXPO visitor registration is free until July 31 (Super Early Bird); from August 1 it moves to Early Bird pricing of KRW 10,000, and to a standard rate of KRW 20,000 thereafter.Supporting programs have also been strengthened. During the event, offerings include hands-on workshops for in-depth, practical learning with leading AI technologies and solutions from Korea and abroad; investment matching connecting startups with investors; and an AI experience zone. Beyond simple viewing, the event is designed to serve as a venue for experiencing technology firsthand and connecting AI companies with industry, investors, and talent.As AI spreads beyond individual services and solutions into every facet of enterprise operations, the event is expected to offer a chance to survey the latest trends at a glance and to gauge the potential for real-world adoption and commercialization.

EDOM Technology(TWSE: 3048), Asia's best solutions provider, celebrates its 30th anniversary this year. Since its establishment in 1996, EDOM has worked with global partners to lead innovative technologies and witnessed the growth trajectory of the electronics industry along the way. Faced with the booming trend of diversified AI applications, EDOM will focus on four major innovation areas including power technologies, cybersecurity, optical communications, and biomedicine. Through complete technical support and supply chain services, EDOM will help customers accelerate the implementation of AI, smart networking, and edge computing applications, and jointly promote the development of smart manufacturing, smart medical care, and next-generation digital infrastructure.1996 is a critical year in the history of science and technology. This year, the Internet began to fully enter public life, and the core technology, software, and hardware that laid the foundation for modern digital life were born at this time. The company encountered the Asian financial crisis in 1997 when it was first established, but the rise of the Internet from 1996 to 2000 also brought excellent development opportunities. In its early days, EDOM was optimistic about the emerging 3D graphics chips, modem chips, and radio frequency components. Using this as a starting point, EDOM gradually established a foothold in the electronic circuit market and wrote important milestones along with the changes in the industry.Since its listing in 2002, EDOM has continued to deeply explore the Asia-Pacific market. Following the trend of the Asia-Pacific region becoming an important manufacturing base for the global information industry, EDOM has actively expanded its service base and strengthened its supply chain support capabilities. With the rapid development of the technology industry, EDOM has experienced steady growth: in 2010, driven by the popularity of smartphones and tablets, annual revenue exceeded US$1 billion for the first time; in 2014, it seized the opportunity of the rise of mobile communications, with the Internet of Things and mobile payment, annual revenue exceeded US$2 billion; in 2019, benefiting from the growth in market demand for wearable devices and network communications, annual revenue exceeded the milestone of US$3 billion. Facing a new wave of industrial changes driven by AI, EDOM achieved annual revenue of US$3.7 billion in 2025, ranking among the top ten electronic component distributors in the world, and continues to move towards the revenue target of US$4 billion.Over the past thirty years, EDOM has witnessed the birth of epoch-making applications such as PCs, mobile phones, tablets, electric vehicles, data centers, robots, smart manufacturing and industrial control, and autonomous vehicles. Every new application can be transformed from concept to practice, relying on the efforts of innovators and the support and collaboration of a complete supply chain system. Today, artificial intelligence technology has once again brought new development opportunities. AI has moved from the layout of cloud giants to the enterprise and industrial manufacturing fields, and has penetrated into daily life. Under this trend, EDOM is optimistic about four major areas:Power and cooling technologies: With the rapid growth of AI computing requirements, high-efficiency power management and cooling technology will become an important foundation to support the operation of future electronic products and data centers.Cybersecurity: In the era of digitalization and the Internet of Everything, the importance of information security protection continues to increase, and cybersecurity will become an indispensable part of the stable operation of enterprises.Optical communication: Optical communication and co-packaged optics (CPO) technology are regarded as important keys to breaking through the bottleneck of AI computing transmission. They will not only improve the operational efficiency of data centers, but also accelerate the development of edge computing and high-speed transmission applications.Integration of semiconductor technology and biomedicine: By combining technology and biomedicine, the automation of testing in medical institutions and laboratories can be further promoted, the process of precision medicine can be accelerated, and key breakthroughs can be brought to life sciences.Wayne Tseng, Chairman of EDOM Technology, said: "In the torrent of technological change, our vision of making the world a better place through innovation has remained steadfast. We are deeply honored to witness and participate in the development and evolution of the electronics industry. We sincerely thank the vendors, customers, and partners who have worked side by side with us over the past thirty years, and we look forward to continuing to work together in leading the next generation of technological innovation in the future."With thirty years of evolution, EDOM resonates with the pulse of the global electronics industry. Facing the ever-changing technological wave, we always keep abreast of the latest trends, enrich the electronics industry ecosystem, and open chapters of innovation with global partners.

As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms.Against this backdrop, TEAMGROUP General Manager Gerry Chen warned that the industry could face a period of unprecedented scarcity by 2027. He described the situation as one where "even customers willing to accept higher prices may still face supply risks," potentially echoing the severe chip shortages seen during 2021–2022. Chen noted that even buyers willing to pay premium prices could face significant procurement challenges if they lack long-term strategic relationships with original chip manufacturers, leaving them highly vulnerable to supply disruptions.In response, TEAMGROUP initiated a strategic transformation in 2025, redirecting 80% of its resources from the consumer segment toward long-lifecycle, high-reliability applications. The company is now focused on mission-critical sectors, including industrial automation, enterprise infrastructure, defense, and healthcare, while also expanding into military-grade storage and high-density computing applications. Leveraging three decades of partnerships with leading global suppliers and its extensive experience in IPC design-in collaboration, TEAMGROUP has strengthened supply-chain resilience and enhanced supply assurance amid ongoing market volatility, positioning itself as a trusted enabler of secure and reliable AI infrastructure.Building supply chain resilience amid persistent memory shortageChen emphasized that the exponential growth of AI-driven demand is outpacing semiconductor capacity expansion, a process that typically requires three to three-and-a-half years to complete. As a result, supply constraints in DRAM and SSD markets are becoming a structural challenge rather than a cyclical phenomenon. In this environment, competitive advantage will increasingly depend on supply assurance, allocation capabilities, and long-term supplier relationships rather than price alone.Leveraging decades-long partnerships with leading memory manufacturers and extensive IPC expertise, TEAMGROUP has established a stable supply framework for industrial PCs and other long-lifecycle applications requiring seven to ten years of product availability. The company works closely with customers to identify alternative component sources, optimize system configurations, and mitigate demand distortion and bullwhip effects across the supply chain. These capabilities have strengthened resilience for customers in mission-critical industries such as automotive, healthcare, and defense.T-CREATE EXPERT P35S & TEAMGROUP INDUSTRIAL P250Q secure data in defense & finance. Credit:TEAMGROUPTEAMGROUP's portfolio spans commercial-grade storage solutions for general confidential data protection, as well as industrial-grade products engineered for deployment in aircraft, naval vessels, unmanned systems, and other high-reliability platforms. The company has showcased these solutions at major industry events, including Embedded World and Japan IT Week.Physical destruction technology enables one-click data destructionThe T-CREATE EXPERT P35S, recipient of the 2026 COMPUTEX Best Choice Award, exemplifies TEAMGROUP's philosophy that "physical destruction is the ultimate safeguard." According to Chen, true data security lies in the complete physical destruction of storage media rather than relying solely on software-based deletion methods.When activated, the SSD's built-in boost chip instantly releases a high-voltage current that physically breaks down the insulation layer of the NAND flash ICs, permanently destroying the storage medium within 2.4 seconds and making data recovery extremely difficult. For everyday protection, AES-256 encryption provides a first line of defense, creating a comprehensive security framework that integrates both hardware- and software-based safeguards.The design is engineered to eliminate any possibility of residual data. Its proprietary circuit architecture uses a zoned sequential-conduction mechanism, enabling high-voltage current to destroy memory chips in a controlled chain reaction. TEAMGROUP's patented "power-resume destruction" technology further ensures destruction integrity by automatically completing the process when power is restored if an interruption occurs during the destruction sequence.To prevent accidental activation, the device incorporates a two-stage fail-safe button requiring deliberate user action. The technology also supports remote activation through 4G/5G networks, radio communications, or SMS commands, allowing data destruction to be triggered from several kilometers away. This capability helps prevent sensitive information from being compromised even if a device is lost, stolen, or captured.The patented technology is currently available in two products: the T-CREATE EXPERT P35S, a portable secure storage device, and the industrial-grade TEAMGROUP INDUSTRIAL P250Q-M80 M.2 high-speed SSD, designed for classified computing environments, financial institutions, and defense applications. Together, they provide a robust cybersecurity safeguard for the defense, finance, and R&D sectors.TEAMGROUP showcases a variety of enterprise-grade SSDs at COMPUTEX. Credit: TEAMGROUPAdvanced specs pave the way for agentic AILooking ahead to the convergence of AI and physical robotics, Chen noted that technology ultimately serves human needs. As AI systems continue to collect and process vast amounts of behavioral, operational, and contextual data, demand for on-premises storage is expected to grow significantly.TEAMGROUP keeps data stable in harsh settings & inspires young teams to innovate. Credit: TEAMGROUPOne example is the emerging long-term care robotics market. These systems must not only deliver healthcare-related capabilities but also retain medical records and behavioral data over extended periods. Such requirements place stringent demands on SSD endurance, reliability, and long-term stability, underscoring the importance of local data storage. Similarly, enterprises are increasingly reluctant to move highly sensitive information—including financial data, proprietary business models, and operational intelligence—to the cloud. As a result, agentic AI systems capable of autonomous decision-making within on-premises environments are gaining strategic importance.To support next-generation AI applications, TEAMGROUP has become one of the industry's early innovators in LPCAMM2 and SOCAMM2 memory technologies. LPCAMM2 enables LPDDR memory, traditionally soldered directly onto notebook motherboards, to become modular and upgradeable, while SOCAMM2 introduces a compact, low-power architecture designed for AI servers and advanced computing platforms, offering an alternative to conventional RDIMM. Together, these technologies offer greater flexibility, serviceability, and power efficiency for future AI systems.Beyond supplying low-power memory components, TEAMGROUP has evolved into a comprehensive solution provider, helping customers maintain data integrity and system stability in demanding operating environments characterized by vibration, thermal challenges, and continuous workloads. At the same time, the company encourages its young talent to pursue bold innovation while investing in next-generation DDR6 R&D, laying the groundwork for future AI infrastructure and intelligent edge computing applications.Amid the ongoing memory supercycle, TEAMGROUP has demonstrated strategic resilience and innovation beyond the role of a traditional module manufacturer. By combining supply-chain expertise, advanced physical-level security technologies, and next-generation memory architectures, the company aims to help customers safeguard critical digital assets while preparing for the next phase of AI-driven transformation.For more information, please visit.