As global healthcare systems evolve, preventive medicine and digital health technologies are becoming key drivers of medical innovation. Aging populations, rising healthcare costs, and increasing chronic diseases are accelerating the transition from treatment-oriented care toward preventive, personalized, and data-driven health management.Within this transformation, Traditional Chinese Medicine (TCM) is being re-examined beyond its historical and cultural role. Increasingly, TCM is discussed in the context of systems-based healthcare, lifestyle regulation, and long-term health management. Its emphasis on prevention, adaptation, and holistic regulation reflects growing global interest in healthcare models that focus on maintaining balance and improving overall well-being.TCM has traditionally emphasized the dynamic relationship between human health and environmental changes. Practices such as seasonal adaptation, sleep regulation, dietary management, and stress balance share conceptual similarities with modern healthcare research in areas including circadian rhythms, lifestyle medicine, and preventive care.Meanwhile, advances in digital technologies are reshaping healthcare delivery. Wearable devices, mobile health platforms, and artificial intelligence (AI)-based analytics now enable continuous monitoring of physiological indicators, including heart rate variability, sleep patterns, activity levels, and stress-related signals. These technologies create new opportunities to connect traditional health concepts with modern data-driven healthcare systems.The integration of TCM with digital innovation has become an emerging interdisciplinary field. AI-assisted diagnosis, wearable health monitoring, smart herbal medicine production, digital supply chains, and biotechnology applications are opening new pathways for the modernization of traditional medicine.This article series explores the evolving role of TCM in modern healthcare, covering preventive health, lifestyle management, wearable technologies, AI applications, herbal biotechnology, smart agriculture, and the globalization of traditional medicine.Taiwan’s development in biotechnology, information technology, precision agriculture, and healthcare innovation provides a unique foundation for advancing this integration. Emerging research in plant-derived biomaterials, intelligent cultivation systems, and herbal medicine applications demonstrates the potential of combining traditional knowledge with modern science and engineering.The modernization of TCM does not mean replacing traditional practices with technology. Instead, it represents a process of reinterpretation—using scientific validation and digital tools to enhance understanding, application, and global communication of traditional healthcare concepts.Challenges remain, including standardization, clinical validation, regulatory frameworks, and data integration. However, as healthcare continues to move toward predictive, personalized, and continuously monitored models, TCM may contribute valuable perspectives on preventive care, holistic health management, and system-oriented healthcare thinking.The convergence of traditional medicine and digital innovation will continue to shape new possibilities for the future of global healthcare.

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.The announcement coincides with the opening of 'FMS (Future of Memory and Storage) 2026,' held at the Santa Clara Convention Center in California from August 4 to 6 (local time). The company is set to present HBF as a key technology to overcome memory bottlenecks in the AI era through keynote speeches and panel discussions during the event.HBF technology is a new memory layer between HBM and SSDs. It enables high-speed data transfer similar to HBM while significantly expanding capacity by leveraging NAND technology. With the expansion of AI inference driving a surge in data volumes to process, HBF is gaining attention as a technology that simultaneously resolves bandwidth and capacity scalability challenges.This milestone comes about six months after launching the consortium in February this year, following the initial standardization partnership with Sandisk in August 2025. Capacity specifications cover up to 512GB based on two stack configurations (8-high and 16-high NAND dies). Bandwidth is categorized into three grades (Grade1~3), delivering scalable performance from approximately 0.4TB/s to 3.0TB/s.A key highlight is the interconnect linking HBF technology and processors. HBF technology adopts UCIe, an industry standard connection interface, laying the groundwork to flexibly integrate HBF technology across different processor types, including GPUs and CPUs.The standard also outlines 1. connection interfaces and electrical characteristics, 2. reliability and packaging guidelines for HBF die stack process, 3. software I/O guidelines.The specification was disclosed through the Open Compute Project (OCP), world's largest open data center technology initiative, positioning it as an open standard for the entire industry rather than a proprietary technology.SK hynix plans to leverage this release to expand the adoption of HBF technology in the AI storage market and foster the surrounding ecosystem. With Google and Tenstorrent currently participating in the HBF consortium, the consortium aims to expand its reach while enhancing technical maturity and market acceptance based on open collaboration.On the opening day of FMS 2026 (August 4, local time), SK hynix Executive Vice President Kim Chun-sung (Head of Solution Development) and Vice President Kang Uk-song (Head of Next Generation Product Planning) will deliver a joint keynote address, titled 'Orchestrating Efficient AI Infrastructure through Tiered Memory in the Era of Agentic AI.'As Agentic AI rapidly commercializes, the volume of data to process is surging alongside growing demands for higher speed and efficiency. Recognizing that a single memory type cannot address these complex challenges, both speakers will present the necessity and future direction of a next-generation architecture based on 'Tiered Memory' a framework that connects and optimizes diverse memory types into a unified system.On August 6, SK hynix Vice President Lim Eui-cheol (Head of Solution AT), Sandisk Vice President Rajeev Nagabhirava and Google DeepMind Senior Staff Engineer Xiaoyu Ma will join a panel discussion titled 'Breaking the Memory Wall with High Bandwidth Flash.' Bringing together key leaders across memory, storage and AI, the session will examine fundamental shifts in memory architecture across AI infrastructure and highlight the potential and role of HBF as a transformative solution.Furthermore, SK hynix will host an exhibition booth throughout FMS 2026, featuring a Partnership Zone, a Next-Generation Tech Zone and Tech Sessions.Notably, the company will publicly reveal for the first time its tenth-generation (V10) 375-layer 4D NAND wafer and products, which are currently under development. The 375-layer 4D NAND improves performance per watt by 2.5 times compared to the previous generation, making it optimized for AI infrastructure environments like data centers that demand high power efficiency and performance. The company plans to initiate mass production of high-performance, high capacity eSSDs based on the 375-layer 4D NAND early next year to reinforce its leadership in the AI NAND market.SK hynix will also display a versatile product lineup spanning mobile, PC, automotive and robotics, showcasing the company's competitive edge in memory technology and its collaborative achievements with customers in the AI era."With the rapid spread of AI applications, we are at a point where overall data processing structures must be redesigned," said SK hynix Executive Vice President and Head of Solution Development Kim Chun-sung, adding, "Through HBF, SK hynix will expand the boundaries between memory and storage and contribute to building new architectures that enhance overall system efficiency."SK hynix exhibition booth at FMS 2026. SK hynix

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data center environments. Leveraging CXL technology, the MXC chip enables customers to build memory infrastructure with higher capacity, improved resource utilization, and greater flexibility.The CXL 3.2 MXC complies with CXL Type 3 specifications, including both CXL.mem and CXL.io protocols. It is designed with PCIe 6.x and CXL 3.2 protocol support, delivering data transfer rates of up to 64？GT/s. The chip integrates dual DDR5 memory controllers that support up to 8000？MT/s DDR5 memory. By converting host-side CXL memory requests into DDR commands in real time, it enables efficient data exchange between the host and backend memory, effectively breaking through the memory capacity limits of traditional servers.Additionally, the chip integrates PCIe 6.x PHY, DDR5 PHY, dual RISC-V processor subsystems, and a comprehensive set of management interfaces. It supports multiple CXL memory expansion form factors, including PCIe AIC cards and EDSFF modules, providing critical support for emerging memory applications such as memory expansion, pooling, and tiered memory architectures."The trial production of the CXL 3.2 MXC chip marks an important milestone in Montage Technology's pursuit of CXL innovation and commercialization," said Stephen Tai, President at Montage Technology. "As memory demands continue to surge in the AI era, we are providing our customers with high-bandwidth, large-capacity, and highly reliable memory expansion solutions, accelerating the large-scale adoption of CXL in data center and AI infrastructure."In addition to the chip, Montage Technology provides a complete software development kit (SDK) along with analysis and testing tools to help customers accelerate product development, compatibility validation, and mass production. The CXL 3.2 MXC has already been integrated into next-generation CXL products by leading memory module manufacturers, including Samsung and SK hynix, with initial validation successfully completed. The solution is designed to align with leading server platforms, including Intel Xeon and AMD EPYC, to ensure broad interoperability and optimal performance.Customer and Partner Feedback:Jangseok Choi, VP of Memory Product Planning at Samsung Electronics stated: "The combination of CXL 3.2 MXC with DDR5 memory technology offers data center customers a solution that balances performance and capacity. Our collaboration validates the value of CXL in increasing system memory capacity and resource utilization, and provides additional options for next-generation AI infrastructure."Uksong Kang, Head of Next Gen Product Planning&Std at SK hynix noted: "With the rapid adoption of large language models and generative AI, memory has become a critical factor in system performance. Montage Technology's MXC product demonstrates strong potential for supporting high-capacity memory expansion and resource sharing. We look forward to deeper collaboration in ecosystem validation and product innovation."Dr. Debendra Das Sharma, Senior Fellow and Chief I/O Architect at Intel remarked: "AI, next-gen cloud systems, and today's industry economics are reshaping server memory architecture and driving demand for CXL. Montage Technology's CXL 3.2 MXC demonstrates how the maturing CXL ecosystem delivers protocol support, compatibility, and performance, helping to unlock the memory expansion capabilities of next-generation Intel Xeon platforms."Amit Goel, corporate vice president, Compute and Enterprise AI Platform Solutions Engineering, AMD added: "AI and data center workloads are driving continuous evolution of system architecture, making memory a key factor in performance and scalability. We look forward to our continued collaboration with Montage Technology on CXL technologies to deliver a foundation for building more flexible and efficient memory architectures."Upcoming Events:Montage Technology will showcase its CXL 3.2 MXC solutions at the CXL DevCon on August 3, 2026, at the Santa Clara Marriott, and at the FMS (Future of Memory and Storage) exhibition from August 4–6, 2026, at the Santa Clara Convention Center (Booth #845), both in Santa Clara, USA. We warmly invite our customers, industry peers, and partners to visit our booth for in-depth exchanges on industry trends and potential collaboration opportunities.Montage Technology Announces Industry-First Trial Production of CXL 3.2 MXC Chip. Credit: Montage Technology