As nations worldwide race to attract semiconductor manufacturing, most have rolled out sweeping tax incentives targeting the industry. According to a 2025 policy proposal from the Semiconductor Division of the Japan Electronics and Information Technology Industries Association (JEITA), tax breaks are proving even more effective than direct subsidies in spurring investment. Countries like the US and South Korea have introduced exceptionally generous tax regimes for chipmakers, giving them a competitive edge

Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign that falsely characterizes YMTC's chips as spyware-laden and a threat to national security

Japanese telecommunications company NTT is repositioning itself as a next-generation infrastructure provider, betting on optical communications and quantum technologies to regain prominence in global markets. The Tokyo-based firm has dropped its full corporate name, "Nippon Telegraph and Telephone," from external communications as part of its transformation from traditional telecom operator to technology leader

Qualcomm CDMA Technologies (QCT), a unit of Qualcomm Inc., has finalized its acquisition of Israeli vehicle-to-everything (V2X) chipmaker Autotalks, reinforcing its push into connected car communications. The long-anticipated deal, delayed by two years of regulatory scrutiny, will strengthen Qualcomm's position in automotive connectivity and safety, while sparking debate over potential impacts on market competition

Amid intensifying US-China tech rivalry and deepening supply chain fragmentation, Huawei is mounting a formidable response through a series of proprietary technologies and product launches, signaling its comprehensive breakthroughs in chip design, system integration, and hardware engineering

Tesla CEO Elon Musk, now refocused on company operations after stepping back from government affairs, has unveiled plans to build a fully vertically integrated battery supply chain in the US as part of a strategy to cut reliance on Chinese materials

China's largest cloud and internet companies are implementing backup supply chain strategies as bilateral trade uncertainties continue. Baidu Inc., Alibaba, Tencent and Huawei have developed contingency plans with domestic memory module manufacturers, beginning gradual localization in early 2025

European financial securities firm UBS recently released a report indicating that Samsung Electronics' anticipated 12-layer HBM3E, originally expected by June 2025, may not be ready to supply Nvidia until the fourth quarter of 2025

As a new round of China–US trade talks took place in London, the United States held firm on restrictions targeting China's access to advanced artificial intelligence (AI) chips, with Nvidia products remaining on the export control list

According to the Economic Times, citing an official statement, Japanese chipmaker Renesas has clarified that ongoing issues with Wolfspeed will have no impact on its OSAT joint venture project in India. "The situation involving Wolfspeed will have no impact on the OSAT project, including production, operations, or the relationship between Renesas and CG Power," adding that it does not plan to produce silicon carbide (SiC) devices under the OSAT collaboration

US-China trade talks resumed in London on June 10, extending a new bilateral economic and trade consultation mechanism launched with more than six hours of discussions the day before. While no deal was reached, both sides signaled cautious optimism

The Indian government has amended Special Economic Zone (SEZ) rules to support semiconductor and electronics component manufacturing, reducing the minimum land requirement from 50 hectares to 10 hectares for SEZs dedicated to these sectors. The changes, notified on June 3, 2025, also relax conditions on encumbrance-free land, allowing mortgaged or leased land held by government agencies to be used for SEZ purposes

Ampoc, a distributor of PCB wet process equipment and semiconductor materials, announced that in response to the growing global demand for high-end materials in advanced semiconductor processes, it will collaborate with South Korean semiconductor material manufacturer DCT Material to establish a joint venture company in Taiwan by the end of 2025. This partnership aims to introduce advanced process material technologies with mass production experience into Taiwan, further strengthening product deployment in the Asian market and providing localized services to key semiconductor customers

Following reports that TSMC is considering establishing a semiconductor wafer fab in the Middle East, some observers suggest that Samsung Electronics may also seek opportunities to expand its overseas footprint. Whether Samsung will consider setting up a plant in the Middle East could hinge on securing artificial intelligence (AI) chip orders