The year 2024 marks a pivotal shift in the silicon carbide (SiC) industry, as unprecedented production increases by Chinese manufacturers transform the global supply chain. This critical compound semiconductor material, once valued for its scarcity, has become a double-edged sword causing ripples throughout the sector
TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced packaging supply chain, driven by fresh investments from OSAT providers, IDMs, and new entrants that are disrupting traditional roles
Micron has released its first-quarter fiscal 2025 (1QFY25, ending November 28, 2024) financial results, highlighting strong performance in its HBM segment. However, a weaker-than-expected outlook has dampened market confidence, casting a shadow over South Korean rivals Samsung Electronics and SK Hynix
Japanese NAND flash maker Kioxia debuted on the Tokyo Stock Exchange's Prime Market on December 18, marking a significant milestone. Despite an initial stock price surge, the company's current market value stands at less than half of the JPY2 trillion (approx. US$13 billion) valuation it held upon separating from Toshiba in 2018
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations than expected
The Chinese chip market faces severe challenges during the semiconductor industry's down cycle, with 14,648 chip companies shutting down in 2024. However, the entrepreneurial spirit remains resilient, as evidenced by 52,401 new registrations in the same year
On December 16, Gree Electric Chairwoman Ming-zhu Dong told Sina Finance CEO Qing-xu Deng, "Gree's chips have succeeded. We have achieved everything from independent research and design to manufacturing and a complete semiconductor value chain," according to ICSmart
Amid surging AI demand, SK Hynix has unveiled a 61TB SSD tailored for AI data centers, marking a significant leap in the enterprise SSD (eSSD) market and intensifying competition with industry leader Samsung Electronics
Samsung Electronics (Samsung) is set to construct a test line for 10nm seventh-generation DRAM (1d DRAM) at Pyeongtaek Plant 2 (P2), strengthening its competitive position and enhancing yield improvement for new generation products
The global wafer foundry landscape is undergoing a dramatic transformation. TSMC maintains its dominance in advanced nodes below 7 nanometers, while competitors Samsung and Intel continue to struggle with outdated IDM models. Meanwhile, Japan-backed Rapidus and China's SMIC face significant technological and financial challenges despite substantial government support
In 2024, China's artificial intelligence (AI) framework market is experiencing robust growth, with Huawei's MindSpore securing nearly 30% market share, successfully positioning itself among the global mainstream AI frameworks. This data was revealed at the recent MindSpore AI Framework Summit hosted by Huawei
China has approved a new set of generative artificial intelligence (GenAI) services, marking the smallest batch this year, indicative of a potential saturation in the domestic AI market
Samsung Electronics Co. and Texas Instruments Inc. completed final agreements to get billions of dollars of government support for new semiconductor plants in the US, cementing a major piece of the Biden administration's Chips Act initiative
Samsung Display is advancing its microOLED technology by shifting from silicon wafers to glass substrates, a move aimed at improving production efficiency and reducing costs for AR/VR devices
Tesla's Shanghai "Gigafactory" is undergoing significant personnel changes as Chinese media reports indicate that Gang Song, the site's director and VP of manufacturing, has departed to pursue a position in the green energy industry with Envision Group
