The rapidly growing demand for AI and augmented reality (AR) smart glasses in China has sparked a tenfold increase in sales during the first half of 2025, significantly accelerating the adoption of microLED technology for miniature displays. Industry analysts anticipate 2025 will become a critical year for full-color microLED development, though mature single-chip full-color microLED displays are projected to appear only by 2027
Samsung Electronics revealed it is developing its seventh-generation high-bandwidth memory (HBM4E), with a target bandwidth of over 3TB per second. The announcement comes as Nvidia continues to pressure suppliers to increase the bandwidth of sixth-generation high-bandwidth memory (HBM4), signaling that the HBM speed race will intensify
As the AI boom drives demand for advanced packaging, chip testing at the backend is facing challenges in temperature, frequency, and speed. In response, the testing interface industry has been pushed into a new wave of product upgrades
SenseTime has signed a strategic partnership with Cambricon Technologies to enhance software-hardware integration, boost chip compatibility, and advance the development of China's AI ecosystem
AI inference chip startup Rebellions announced on October 15 that it has joined Arm's Total Design ecosystem. The announcement, made at the OCP Global Summit 2025, positions the company to accelerate the development of customized, high-efficiency chips for next-generation AI data centers
Following Vivo's launch of its X300 flagship earlier this year, Oppo introduced its Find X9 series on October 16, 2025, aiming to strengthen computing power, energy efficiency, and imaging performance. Notably, Oppo increased the telephoto camera resolution to 200 million pixels (200MP) and partnered with Sweden-based Hasselblad to develop the first-ever teleconverter lens designed for smartphones
Tesla is reportedly expanding its semiconductor operations in South Korea with a new organization in Hwaseong, Gyeonggi Province, the same city that houses Samsung's wafer fabrication hub. The US EV maker has started hiring semiconductor engineers, stirring industry attention as it strengthens collaboration with Samsung after inking a US$16.5 billion foundry deal for its upcoming AI6 chip
Alibaba Cloud, the cloud unit of Alibaba Group, has opened its second data center in the United Arab Emirates (UAE) — its first in nearly a decade — as the Chinese tech giant deepens its presence in one of the Middle East's fastest-growing digital markets
BOE Technology, China's top display maker, is rapidly scaling its OLED presence. In the first half of 2025, BOE shipped 71 million OLED panels, cementing its lead in China and securing second place globally. While strengthening its grip on small-sized displays, BOE is now aggressively expanding into mid- and large-sized IT OLEDs, signaling a direct challenge to Samsung Display's dominance in the premium segment
The Dutch government's one-year freeze of Wingtech subsidiary Nexperia's assets, on the grounds of national security, has once again highlighted vulnerabilities in the semiconductor supply chain. The move is prompting China's chip industry to accelerate internal restructuring to hedge against growing geopolitical uncertainty
Vivo unveiled its new flagship X300 series of smartphones this week, followed by the introduction of its new OriginOS 6 operating system, which adopts a two-pronged artificial intelligence strategy to serve both global and domestic Chinese markets
Samsung Electronics is rolling out a new stock-based rewards program in a strategic move to attract and keep its top employees amid a fierce global competition for talent
At the 2023 World Economic Forum in Davos, Microsoft CEO Satya Nadella shared an illustrative story about a rural Indian farmer using ChatGPT to apply for government subsidies. Nadella emphasized that this US-developed technology had quickly reached diverse users globally within a year, highlighting both its practicality and rapid adoption
The Department of Electronic Engineering at Tsinghua University (THU) in Beijing has developed the world's first "sub-angstrom snapshot spectral imaging chip" named Rafael. The research findings were published online in Nature, marking a significant advance in high-precision photonic chips and imaging technology in China. This breakthrough ushers intelligent photonics into an ultra-high resolution era below 0.1 nanometers (sub-angstrom level)
Samsung Electronics is reportedly pouring KRW1.1 trillion (approx. US$773 million) into next-generation chipmaking equipment in a high-stakes bid to close the gap with rivals TSMC and Intel in the global race to produce smaller, more powerful semiconductors
