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Friday 9 January 2026
Commentary: China redirects AI race to manufacturing systems
China's Ministry of Industry and Information Technology, together with eight other government departments, has released the plan for "AI + Manufacturing." While framed as an industrial upgrade policy, it functions in practice as a strategically significant AI roadmap
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Monday 12 January 2026
Huawei steps up 2026 smartphone offensive, Pura series targets market share
Despite ongoing US restrictions on Huawei's access to 5G smartphone chips and Google Mobile Services (GMS), the company has re-established a strong position in China by advancing its HarmonyOS ecosystem and pushing for semiconductor component breakthroughs. In 2025, Huawei briefly returned to the top of China's quarterly smartphone sales rankings and currently remains among the market's top three vendors by share
Monday 12 January 2026
South Korea accelerates SiC and GaN power chip production with new policy push
South Korea is stepping up policy support for next-generation power semiconductors as part of a broader push to strengthen domestic chip manufacturing and reduce reliance on overseas suppliers, with local foundries accelerating the commercialization of silicon carbide (SiC) and gallium nitride (GaN) devices
Monday 12 January 2026
Lenovo aims to double India business in three years
Lenovo is aiming to double its business in India over the next three years, leveraging strong growth in its Motorola smartphone segment and its infrastructure and services verticals, according to company executives. Lenovo's Asia Pacific leadership highlighted domestic consumption and the "India for the world" strategy as central to the company's future expansion, with India emerging as one of Lenovo's fastest-growing markets worldwide, according to the Economic Times
Monday 12 January 2026
TCL climbs to No. 2 in global TV shipments

TCL has risen to second place worldwide in TV shipments, trailing only Samsung Electronics, as the Chinese electronics group leverages supply chain integration and display technology development to gain share in the global TV market

Monday 12 January 2026
India targets post-quantum secure chip personalization with Kaynes Semicon-SEALSQ joint venture
India's semiconductor ambitions are beginning to extend beyond fabrication and conventional packaging into secure chip personalization and cryptographic control, as Kaynes Semicon and SEALSQ detailed the roadmap for their newly approved joint venture (JV)
Monday 12 January 2026
Weekly news roundup: AI memory effects in DRAM, HBM4, and TSMC's global expansion
Below are the most-read DIGITIMES Asia stories of the first full week of 2026: January 5-11
Monday 12 January 2026
Beijing pulls out rare earth card against Japan; Murata says production unaffected so far
On January 6, 2026, China's Ministry of Commerce (MOFCOM) announced that, to safeguard national security and interests, it would strengthen export controls on dual-use items to Japan. It also initiated an anti-dumping investigation on specialty gases exported to Japan's chip industry. This goes far beyond its previous rare earth controls, with vague definitions for military and civilian applications
Monday 12 January 2026
Samsung eyes BOE OLED panels for Galaxy S series
Samsung Electronics is reportedly evaluating whether to source OLED display panels from China's BOE Technology Group for its flagship Galaxy S smartphone lineup, as it looks to rein in component costs while weighing legal and quality risks
Monday 12 January 2026
Sharp-Adani LCD proposal tests India's ability to build a full-scale panel supply chain from scratch
Sharp ceased production at its Sakai Display Product (SDP) factory in late August 2024, ending operations at the world's only 10G LCD panel fab. Despite this closure, Sharp is pursuing plans to build a new 10.5G LCD panel manufacturing facility in India in partnership with the Adani Group, a major Indian conglomerate. The initiative reflects Sharp's continued interest in expanding its LCD panel production, though significant challenges remain
Monday 12 January 2026
Chinese AI startups face 'go global or decouple' dilemma after Manus deal
China's Ministry of Commerce announced on January 8, 2026, that it supports lawful cross-border business and international technology cooperation, emphasizing that overseas investments, technology exports, data transfers, and mergers and acquisitions must comply with applicable regulations and complete required procedures. The ministry is currently reviewing Meta Platforms' acquisition of artificial intelligence (AI) startup Manus, working with other authorities to assess whether the transaction aligns with export control rules, technology import-export governance, and outbound investment regulations
Monday 12 January 2026
Samsung reportedly lands US$550 million state loan for chipmaking equipment
Samsung Electronics has reportedly secured KRW800 billion (US$550 million) through a low-interest loan program from the Korea Development Bank, according to sources cited by Korean media
Monday 12 January 2026
Taiwan's CyberPower shifts focus to AI-driven data center power as sales dip
CyberPower Systems, a Taiwanese maker of uninterruptible power supply systems, said its revenue declined modestly in December 2025 and for the full year 2025, as changes in US tariff policy and customer inventory adjustments weighed on shipments
Monday 12 January 2026
Tai-Tech Advanced Electronics posts record 2025 revenue on strong orders and pricing
Tai-Tech Advanced Electronics posted record revenue in December, the fourth quarter, and the full year of 2025, driven by strong AI-related demand and an initial round of price increases for ferrite bead products, the company said
Monday 12 January 2026
TEL expands AI memory capex, targets etching equipment market share
Japanese semiconductor equipment maker TEL is ramping up investments to capitalize on a supercycle in memory demand driven by artificial intelligence (AI) servers. With DRAM and other memory prices expected to surge roughly 10x starting fall 2025, rapid global data center expansion is fueling explosive demand for advanced semiconductor manufacturing tools
Monday 12 January 2026
India roundup: India's OSATs are comfortable with materials today, but that may not last
India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens a US$36 million R&D hub in Chennai to boost AI, software, and process control capabilities