CONNECT WITH US
Monday 17 August 2026
Fallout from Wingtech's Nexperia rupture: the price of rebuilding China's chip supply chain
Wingtech is entering a sharply different phase after dismantling much of its product-integration business and losing effective control over parts of Nexperia's overseas operations...
LATEST STORIES
Tuesday 18 August 2026
South Korea's Gwangju chip hub faces looming water crunch as experts push underground storage and AI management
Samsung Electronics and SK Hynix are preparing to invest in four memory fabs in southwestern South Korea, but alongside power infrastructure, the semiconductor industry's uninterrupted demand for water is emerging as another major burden on the region.
Tuesday 18 August 2026
China's Horizon Robotics sets J7 against Nvidia, Tesla

Horizon Robotics is preparing its next-generation Journey 7 (J7) automotive AI chip family for mass production in 2027, aiming to extend its lead in China's L2+ assisted-driving market into the higher end of autonomous-driving computing.

Tuesday 18 August 2026
MicroLED still lacks key LTPO TFT tech

MicroLED remains a promising next-generation display technology, but industry analysts say its commercial breakthrough still hinges on thin-film transistor (TFT) technology and the participation of South Korean panel makers Samsung Display (SDC) and LG Display (LGD). Yet SDC is reportedly taking a cautious stance on microLED TV applications.

Tuesday 18 August 2026
Samsung faces tougher HBM4E test after HBM4 comeback

Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is complete, according to Seoul Economic Daily. The caution comes as the memory industry shifts to a generation that will be harder to manufacture at scale.

Tuesday 18 August 2026
India moves beyond electronics assembly as new approvals deepen component and equipment ambitions

India is moving into the next phase of its electronics manufacturing strategy, using its progress in downstream assembly as a base to build domestic capabilities in components, materials, and manufacturing equipment.

Tuesday 18 August 2026
ByteDance and Hollywood reach copyright pact for AI video and image tools
ByteDance and the Motion Picture Association (MPA) have reached an agreement to strengthen copyright safeguards for the Chinese tech giant's AI video and image-generation models, marking a notable shift from confrontation toward cooperation over generative AI and intellectual property.
Tuesday 18 August 2026
Humanoid robots expose the limits of chasing higher TOPS

Humanoid robots are moving from demonstrations toward mass production, changing the priorities of chip design. Instead of simply chasing higher AI compute and TOPS, or trillions of operations per second, the industry is increasingly focused on how efficiently perception, computing, decision-making, and control can work together within tight power, cost, and latency constraints.

Tuesday 18 August 2026
South Korea-India venture Indichem targets semiconductor materials supply chain without China
A new joint venture between South Korean and Indian chemical firms is betting that semiconductor materials can be made without touching China at any stage, positioning itself as an alternative supply route just as the US-China conflict pushes chipmakers to rethink where their raw materials come from.
Tuesday 18 August 2026
H3 launch ramp pushes Mitsubishi Electric toward a new era of parallel satellite production

The expansion of Mitsubishi Electric's satellite manufacturing business is converging with the higher launch cadence targeted for Japan's H3 program, developed jointly by JAXA and Mitsubishi Heavy Industries (MHI).

Tuesday 18 August 2026
Tech blocs of the new Cold War: US pushes allies to pick a side

The intensifying US-China technology rivalry is moving beyond export controls and semiconductor restrictions. What comes next could matter more: the formation of competing international AI ecosystems.

Tuesday 18 August 2026
AI server demand pushes high-end MLCC lead times toward 40 weeks
Multilayer ceramic capacitor (MLCC) supply is increasingly diverging by product specification, with mainstream components remaining relatively stable while lead times for some high-capacitance, high-specification parts used in AI servers stretch toward 40 weeks.
Tuesday 18 August 2026
South Korea telcos pass KRW1 trillion in first-half AI data center revenue
South Korea's three major telecom operators generated more than KRW1 trillion (approx. US$706 billion) in combined artificial intelligence data center revenue in the first half of 2026, as demand for AI computing lifted utilization across their facilities. The companies are now expanding capacity in stages, with carriers saying they want to secure customer demand before committing to larger investments.
Monday 17 August 2026
SK keyfoundry expands 8-inch capacity as China demand strains supply

SK keyfoundry has approved KRW90 billion (approx. US$64 million) in capital spending to expand its 8-inch foundry capacity, a rare move for a company that has long prioritized maintaining existing production lines.

Monday 17 August 2026
Samsung's China sales overtake US; Nvidia not among top five customers
Samsung Electronics' sales to China and the US surged in the first half of 2026 as an AI-driven memory upcycle boosted its semiconductor business, while Nvidia did not rank among the company's five largest customers despite growing ties between the two companies in high-bandwidth memory (HBM).
Monday 17 August 2026
LG-Nvidia physical AI partnership speeds up as robotics chief reportedly heads to South Korea

Less than a week after LG Group and Nvidia signed a strategic memorandum of understanding (MOU), Madison Huang, Nvidia's senior director of product marketing for Omniverse and robotics, is reportedly preparing to visit South Korea and head directly to one of LG's key robotics R&D sites.