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Monday 29 June 2026
Samsung chair backs Korea's southwest chip cluster, maps nationwide investment
Samsung Electronics chairman Lee Jae-yong said Gwangju is being considered as a candidate site for Samsung's next semiconductor complex, lending corporate backing to South Korea's plan to build a second chip production base in Gwangju and the broader Jeolla region in the country's southwest.
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Tuesday 30 June 2026
Samsung commits KRW2,655 trillion to future industries, anchoring new Gwangju fab
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued buildout of its existing Pyeongtaek and Yongin semiconductor clusters and a fresh push into Korea's southwestern Honam region, where the bulk of the new money is aimed at memory capacity.
Tuesday 30 June 2026
HKC IPO gives China's display sector a third heavyweight

HKC Corporation has debuted on the Shenzhen Stock Exchange main board, cementing a three-way leadership structure in China's display panel industry alongside BOE and TCL CSOT while securing fresh capital to expand OLED, oxide semiconductor, and Mini LED technologies.

Tuesday 30 June 2026
Commentary: AI memory boom rewrites chip pricing power, leaving Apple searching for leverage with CXMT

For more than a decade, Apple built one of the industry's most profitable business models by using its purchasing power to drive down memory and component costs before turning hardware upgrades into high-margin revenue. The AI-driven boom in HBM and DRAM is now challenging that strategy.

Tuesday 30 June 2026
Optiemus, Quectel launch India manufacturing tie-up for automotive and connectivity modules
Optiemus Electronics and Quectel have launched a manufacturing partnership in India to localize advanced wireless modules for vehicles, telecom networks, and industrial systems. The tie-up could improve supply chain resilience, accelerate product launches, and expand access to next-generation connectivity across global markets.
Tuesday 30 June 2026
Samsung revives 1.4nm foundry push as 2029 timeline takes shape

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The Bell reported, citing industry sources.

Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster timeline by 12 years as it warned that even faster construction will not be enough to meet projected AI memory demand.
Tuesday 30 June 2026
AI super cycle lifts semiconductors, but China chip group warns of a distorted boom

AI has pushed the global semiconductor industry into a new "super cycle," but the AI boom is also creating distorted demand, tighter capacity, soaring memory prices, and overheated capital spending, according to China Semiconductor Industry Association executive secretary-general Wang Junjie.

Tuesday 30 June 2026
China's third-largest pure-play foundry's HK filing shows growth, but also rising risks

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position. The prospectus highlights its scale in display driver chips and image sensors, while also warning investors about customer concentration, heavy capital needs, and exposure to shifting trade policy.

Tuesday 30 June 2026
South Korea looks to Taiwan as model for semiconductor decentralization
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
Tuesday 30 June 2026
DRAM price surge tests South Korean memory makers' HBM4 push

Reports in South Korea that SK Hynix is slowing the pace of converting production lines to sixth-generation high-bandwidth memory, or HBM4, and shifting more capacity toward commodity DRAM have drawn market attention.

Tuesday 30 June 2026
Nvidia, Firmus partner on Indonesia AI infrastructure project

A new partnership between Nvidia and Firmus aims to expand access to advanced AI computing for customers worldwide, including AI-native companies, enterprises, and independent software vendors. The deal underscores how demand for large-scale AI infrastructure is reshaping global technology markets, especially in the Asia-Pacific region.

Tuesday 30 June 2026
Riken and Taiwan academia join forces on next-gen compound semiconductors
Japan's world-renowned Riken institute announced in late March 2026 that its homegrown superconducting quantum computer, "Ei-II," jointly developed with the University of Osaka, had officially gone online with 144 qubits and 99.9% fidelity. Taiwan's National Science and Technology Council (NSTC) said Riken will next work with Taiwan's academic community on research, including next-generation compound semiconductors.
Tuesday 30 June 2026
Samsung, SK Hynix step up CO₂ buying as supplies tighten
South Korea's inventories of high-purity carbon dioxide, a critical material used in advanced semiconductor manufacturing, have fallen below normal buffer levels, raising procurement concerns across the chip industry, according to The Elec.
Tuesday 30 June 2026
China's LineShine puts Beijing back on top of supercomputer race

A name largely absent from the global supercomputing stage for years returned to the spotlight at ISC 2026 in Hamburg, Germany.

Tuesday 30 June 2026
China's SiC race shifts from EVs to AI data centers as SICC overtakes Wolfspeed

China's silicon carbide (SiC) supply chain is finding a new growth engine as AI strains data-center power systems, extending a market long driven by electric vehicles.