SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers

Samsung Electronics' 2026 tentative labor-management agreement is expected to pass after already surpassing an 86% voting participation rate within just three days. While the agreement has temporarily eased concerns over potential strikes, South Korea's semiconductor industry is increasingly worried that the newly expanded performance bonus structure, which guarantees employees a fixed percentage of business performance, could negatively impact the country's long-term semiconductor competitiveness

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking, optical interconnects, and system-level architecture design

Huawei has released its Data Storage 2030 white paper, setting out a technology roadmap for the global storage industry over the next five to 10 years, as AI large language models drive data creation into what the company calls the yottabyte era

TP-Link India has started local production of Wi‑Fi 7 devices, beginning with the Omada EAP770 enterprise access point, a move that could accelerate the adoption of next‑generation wireless worldwide. The decision follows India's delicensing of the lower 6 GHz band and positions the company to serve domestic and select international markets, according to The Times of India, AP7AM, and The Statesman

Advantech has deepened partnerships with Nvidia, AMD, and South Korean startups to push a hybrid edge architecture for manufacturing AI, promising faster on-site inference and continuous cloud-driven model updates. Global manufacturers could use this approach to scale Physical AI across factories while managing compute, protocol, and sensor challenges for worldwide adoption

TECO Electric & Machinery announced on the 25th that it signed an agreement to acquire about 78% of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for roughly 200 million ringgit (about NT$1.6 billion). The closing was targeted by the end of August and the firm said the move is intended to expand TECO's data center infrastructure footprint in Southeast Asia to serve global cloud service provider customers

China's humanoid robot market is expanding rapidly, but intensifying price competition and growing concerns over product reliability are beginning to expose structural weaknesses across the supply chain

Japanese space startup Axelspace has formally announced plans to launch up to seven next-generation GRUS-3 Earth-observation microsatellites in as early as July 2026 aboard a Falcon 9 rocket operated by SpaceX from Vandenberg Space Force Base, significantly expanding the company's commercial satellite constellation

Chinese automakers are rapidly gaining ground in Europe's electric-vehicle market, underscoring a transformation from low-cost challengers into formidable global competitors

As the global semiconductor industry confronts the limits of Moore's Law, Huawei has unveiled a new roadmap aimed at extending chip performance growth through architecture, interconnect, and system-level optimisation rather than pure transistor miniaturisation