DIGITIMES Asia news

Thursday 19 March 2026

Tencent to double AI spending on 13% revenue growth as chip curbs reshape capex

Tencent is preparing a sharp escalation in artificial intelligence investment, with plans to more than double spending to over CNY36 billion (US$5.2 billion) in 2026, even as chip export restrictions have disrupted its earlier capital expenditure strategy

Samsung Electro-Mechanics rumored to supply MLCCs to top private aerospace firm

Thursday 19 March 2026

China curbs, Middle East tensions drive surge in chip material risks from gallium to helium

Thursday 19 March 2026

SK Hynix posts record pay, R&D, and capex in 2025

Thursday 19 March 2026

Nexperia's China split sends orders to Taiwan

Thursday 19 March 2026

LATEST STORIES

Thursday 19 March 2026

Fitipower opens Malaysia R&D center to boost global innovation and support

Fitpower officially inaugurated its new office in Puchong Financial Corporate Center (PFCC), Selangor, Malaysia, this week, marking the launch of its Malaysian subsidiary. The move expands Fitipower's global R&D footprint and deepens collaboration within Southeast Asia's semiconductor supply chain

Thursday 19 March 2026

China's photoresist push moves from lab wins to mass supply

China's semiconductor materials localisation is shifting into commercial scale, with domestic photoresist suppliers moving from pilot validation to mass supply, marking a turning point in one of the chip industry's most tightly controlled segments

Thursday 19 March 2026

US reveals Tesla battery deal with LG, lifting veil on supply chain

US government disclosures have shed unusual light on a closely guarded corner of the electric vehicle supply chain, confirming that LG Energy Solution signed a battery supply agreement worth KRW6 trillion (approx. US$4 billion) with Tesla in July 2025

Thursday 19 March 2026

AMD, Samsung deepen AI chip ties with HBM4 supply and foundry talks

AMD CEO Lisa Su met Samsung Chairman Lee Jae-yong on March 18, the same day the two companies signed a memorandum of understanding (MOU) to expand semiconductor cooperation, signalling a broader push into AI chips, memory, and foundry services

Thursday 19 March 2026

Column: OpenClaw pulls AI from cloud to the edge

OpenClaw's rapid rise has pushed "lobster-raising" from a niche developer trend into a cross-industry race spanning chips, hardware, and end devices

Thursday 19 March 2026

Column: OpenClaw ignites China's AI agent land grab

OpenClaw's "lobster-raising" wave is moving from developers into China's internet and software sectors at speed in early 2026. Unlike earlier large-model races centred on parameters and compute, this AI agent cycle is defined by a single question: who controls the user entry point

Thursday 19 March 2026

Intel to expand EMIB capabilities in Malaysia amid Section 232 probe uncertainty

Intel's advanced packaging complex in Malaysia is expected to begin operations later this year, Prime Minister Datuk Seri Anwar Ibrahim said, as the company advances its assembly and testing capabilities and the government emphasises upskilling local talent

Thursday 19 March 2026

Analysis: China's on-device AI chipmakers rush to supply OpenClaw, race for edge AI silicon leadership

OpenClaw is forcing a rethink of the AI hardware stack, shifting the locus of deployment from cloud-based interaction to autonomous, always-on agents running locally on devices

Thursday 19 March 2026

China's mature-node push gathers pace: Nexchip, Silan, Hua Hong step up capacity and integration

China's semiconductor strategy is shifting from leading-edge competition to strengthening mature and specialty nodes. Facing geopolitical pressure and supply chain fragmentation, domestic foundries are accelerating investment in 28nm-class technologies, analog chips, and vertically integrated ecosystems

Thursday 19 March 2026

BYD slides as foreign automakers reclaim ground in China

China's auto market is undergoing a sharp realignment in early 2026, as the phaseout of government subsidies exposes deeper competitive strengths — and weaknesses — among the industry's leading players

Thursday 19 March 2026

Samsung strike vote nears, DS and DX divisions clash over bonuses

As Samsung Electronics' union members vote on whether to strike, market attention is shifting from the labor negotiations themselves to the disparities in benefits and potential conflicts of interest between the company's two core business groups: Device Solutions (DS) and Device Experience (DX)

Thursday 19 March 2026

Hormuz blockade triggers domino effect across semiconductor supply chain

Iran's blockade of the Strait of Hormuz has escalated from a regional shipping disruption into a systemic threat to the global semiconductor industry. Initial market fears centered on crude oil prices — but the real damage is upstream, in the chemical precursors that underpin advanced lithography

Thursday 19 March 2026

Samsung reportedly broadens emergency management as chipflation takes off

Samsung Electronics has reportedly expanded emergency management measures across several key business units as rising semiconductor prices and component costs pressure profitability, according to South Korean media reports

Thursday 19 March 2026

How Hwaseong became South Korea's semiconductor supply-chain capital

The global race to onshore semiconductor production has a new focal point: Hwaseong. Nestled in South Korea's Gyeonggi-do province, the city is quietly emerging as the spine of the country's domestic chip supply chain — and a testbed for AI-driven manufacturing

Wednesday 18 March 2026

AMD's Lisa Su courts Korea: Samsung HBM4 sealed, Naver next

AMD CEO Lisa Su broadened the company's collaboration with Samsung Electronics on next-generation artificial intelligence (AI) memory and met with regional partners, including Naver, during a visit to South Korea

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