SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new US factory, Reuters reported on October 15, citing two people familiar with the matter.

India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on October 12, 2026, according to Dalal Street Investment Journal.

Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in research and development investment. The expansion will extend its portfolio beyond plasma etching into thin-film deposition, advanced packaging, inspection and other semiconductor manufacturing processes.

Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin Memory Technologies (CXMT) prepares to introduce server memory using the architecture by the end of 2026. The competing timelines have raised questions about whether China's memory industry is closing the technology gap with South Korean manufacturers.

SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference systems. The South Korean chipmaker is also exploring ways to stack DRAM directly on AI processors to improve performance and energy efficiency.

On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's semiconductor business, said the company now sees a sustainable development path for Kirin processors over the next decade.

In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D NAND with 128 layers or more, and restrictions on support provided by US persons.

Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor packaging deformation before manufacturing. The investment comes as increasingly complex AI chips create new challenges in managing thermal stress, warpage, and manufacturing yields.

Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology. In this paradigm, AI accelerates perovskite material and process development, while perovskite technology meets the AI era's demand for distributed green power, smart sensing, and site-specific energy solutions.

Rising carbon-fee pressure is accelerating efforts to decarbonize Taiwan's energy-intensive industries, prompting Linde LienHwa Industrial Gases Group to promote oxygen-enriched and pure oxygen combustion technologies that can substantially reduce fuel consumption and emissions. At the 2026 Net-Zero Taiwan and Energy Taiwan exhibitions, held October 14–16 at the Taipei Nangang Exhibition Center, the company is also highlighting hydrogen applications and energy management solutions to support industrial efficiency and energy resilience.

South Korea's LX Semicon is seeking buyers for more than 60 silicon carbide (SiC) power semiconductor patents, winding down a business it entered five years ago to reduce its reliance on display driver ICs (DDIs). The retreat comes as Taiwan's Novatek gains ground in the company's core display chip market, increasing pressure on LX Semicon to develop new revenue sources.

An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities deployed eight firefighting and rescue teams, including a hazardous-materials unit, to investigate the cause and assess the risk of a chemical leak involving nitrogen trifluoride (NF3).

Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display technology. Tandem OLED, which combines higher brightness, longer lifespan, and lower power consumption, is emerging as a key technology for premium PCs, sharpening competition between South Korea's two leading panel makers, Samsung Display (SDC) and LG Display (LGD).

Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond Japan and into Southeast Asian and Indian markets through a Toyota Group trading network.

South Korean inspection equipment manufacturer Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a subsidiary of Taiwan's Delta Electronics Group.