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Wednesday 22 April 2026
Samsung reportedly ramps up GDDR6 supply for Tesla but halts 1d DRAM mass production plan
Samsung Electronics is reportedly increasing production of GDDR6 specifically for Tesla starting in April 2026, even as it simultaneously scales back parts of its broader memory product line and halts plans for mass production of its next-generation 1d DRAM due to insufficient yields
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Thursday 23 April 2026
Interview: Seiko Epson outlines engineered future vision for 2035 amid geopolitical challenges
Amid volatile geopolitical tensions affecting Japan's components, manufacturing, and end-user sectors, Seiko Epson unveiled its Engineered Future 2035 long-term vision. The plan aims to shift Epson from a traditional printer maker into a value-driven company focused on technology innovation and engineering excellence, with improving return on invested capital as a core discipline
Thursday 23 April 2026
Zhen Ding breaks ground on new China site; Zhongji Innolight chairman attends to show support
Taiwanese printed circuit board (PCB) giant Zhen Ding Technology Group held a groundbreaking ceremony for the HD Campus of the "Zhen Ding Technology Group Huai'an Tech City" in Huai'an, China, on April 22. The new park plans to build facilities for high-density interconnect (HDI), modified semi-additive process (mSAP), and high-layer count (HLC) PCBs. Upon completion, the group's total number of factories across four major local parks will reach 23, further strengthening its manufacturing scale in the advanced PCB sector
Thursday 23 April 2026
Japan PC shipments peak on upgrade cycle, correction ahead
Japan's PC market delivered a standout performance in the fiscal year ending March 2026, but underlying demand signals point to a sharp reversal as upgrade-driven momentum fades
Thursday 23 April 2026
SK Hynix builds HBM packaging hub in Cheongju to expand AI memory capacity
SK Hynix has broken ground on a large-scale advanced packaging facility in Cheongju Technopolis, underscoring how the battleground for AI semiconductors is shifting beyond wafer fabrication to the back-end processes that increasingly define performance
Thursday 23 April 2026
IndieSemiC partners with Nordic on wireless modules as India expands design-led semiconductor push
IndieSemiC, an Indian semiconductor and chip design company, has partnered with Nordic Semiconductor to design and commercialize wireless modules for connected devices, as Indian firms seek to capture more value in the semiconductor chain through design, RF integration, certification, and module-level manufacturing
Wednesday 22 April 2026
China pledges to stabilize memory chip supply as industrial growth and AI-driven manufacturing expand
China's industrial economy posted steady first-quarter 2026 growth, driven by strong performance in high-tech manufacturing and broad sectoral expansion, according to Ministry of Industry and Information Technology (MIIT) officials, as cited by Xinhua and People's Daily
Wednesday 22 April 2026
Nvidia-linked Chinese PCB maker jumps on Hong Kong stock debut, targets AI expansion

Victory Giant Technology, a China-based PCB maker and Nvidia supply chain partner, debuted on the Hong Kong Stock Exchange on April 21, with its shares rising as much as 60% on the first day of trading. Founder and chairman Chen Tao said order momentum remains strong, with proceeds from the listing primarily earmarked for capacity expansion in China

Wednesday 22 April 2026
Chinese carmakers face delays as global cybersecurity rules tighten
China has moved faster than any other country in rolling out smart, connected vehicles. But as its automakers push aggressively into overseas markets, they are running up against an increasingly stringent web of global cybersecurity regulations
Wednesday 22 April 2026
Gangwon's expanding semiconductor cluster comes with global implications
South Korea's Gangwon Province is accelerating the development of a semiconductor cluster centered on Wonju, Chuncheon, and Gangneung, aiming to build a full ecosystem. Global supply chains could gain a new hub built on strengths in smart medical semiconductors, geographic proximity to major fabs, and growing Taiwan partnerships that may diversify sourcing and innovation
Wednesday 22 April 2026
Naver, TCS partner on AI and cloud in India during Korea-India summit
Naver has signed a strategic partnership with Tata Consultancy Services (TCS) to jointly develop artificial intelligence (AI) and cloud services in India, marking one of the cooperation deals concluded during a Korea-India summit visit
Wednesday 22 April 2026
CXMT fills LPDDR4X gap as non-China CSPs seek capacity
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory costs soaring and supply tightening, roughly 40% of CXMT's capacity will reportedly be reserved for LPDDR4X, while the remaining 60% is dedicated to advanced DDR5 and LPDDR5 products
Wednesday 22 April 2026
CXMT HBM3 timeline slips, mass production unlikely in 2026
China's leading memory chipmaker ChangXin Memory Technologies (CXMT) is facing fresh uncertainty over the commercialization timeline of its fourth-generation high bandwidth memory (HBM3), according to Korean media reports
Wednesday 22 April 2026
China's humanoid robot makers eye RISC-V over Nvidia Jetson
At the second humanoid robot half-marathon held in the Beijing Economic-Technological Development Area (E-Town), several "Linglong 2.0" humanoid robots powered by a RISC-V AI CPU — the K3 chip — completed the race, standing out as one of the event's key technical highlights
Wednesday 22 April 2026
SJSemi's blockbuster IPO reorders China's chip packaging landscape
Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial intelligence continues to accelerate
Wednesday 22 April 2026
China's Nvidia targets IPO, pivots to Fuxi GPUs for AI and edge computing
China's domestic GPU push has gained a new contender in the capital markets race. Xiangdi Xian Computing Technology (Chongqing) Co., also known as XDXCT, has formally launched pre-IPO preparations after signing a financial advisory agreement with CSC Financial Co., marking a strategic shift from survival mode to expansion