At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), officially opened its 12-inch (300mm) wafer fab on September 28 in Tampines, Singapore. Vanguard and VSMC chairman Leuh Fang said the AI-driven crowding out of capacity has spread across the global semiconductor supply chain, leaving almost no company able to say it has sufficient capacity.

South Korean electronics component suppliers are under growing pressure as rising memory prices drive chip inflation deeper into the supply chain. Finished-goods makers are asking for price cuts of 10% to 20% starting in the third quarter of 2026, while Chinese rivals have been offering bids that are 20% to 30% lower, according to Chosun Biz.

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used in consumer appliances have dropped sharply. The split in the market has opened more room for Chinese suppliers in midrange and general-purpose categories as major manufacturers shift capacity toward higher-value products.