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Thursday 17 September 2026
Exclusive: China's CAS institute charts DUV route to 3nm GAA without EUV
China's advanced semiconductor research has reached another milestone. The Institute of Microelectronics of the Chinese Academy of Sciences has established a gate-all-around (GAA) device development path for advanced process nodes below 3nm that does not rely on extreme ultraviolet (EUV) lithography as its core technology.
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Friday 18 September 2026
Tata Electronics put 16 MoUs on the record at Semicon India, join hands with Nexperia
Tata Electronics has attached a headline number to its supplier-recruitment drive at Semicon India 2026 — 16 memoranda of understanding — but only five have been documented in the company's own announcements, leaving most of the tally resting on a list its chief executive read from the stage. For an India Semiconductor Mission trying to show movement from project approvals to commercial production, the distance between the claim and the paperwork is a fair measure of how early this ecosystem still is.
Friday 18 September 2026
Modi says India's chip mission has reached commercial production as Semicon 2.0 lifts the purse to US$13.5 billion
India's government used the opening of Semicon India 2026 to reframe what it is asking the industry to believe: not that fabs will be built, but that they are already shipping. Prime Minister Narendra Modi told the inaugural session that the mission's second phase is funded at US$13.5 billion against roughly US$8 billion for the first, and that the annual conference has moved through policy, projects, and pilot lines to arrive at commercial output — a claim the government is now inviting equipment, materials, and chemicals suppliers to underwrite with their own capital.
Friday 18 September 2026
China sees a second chance in VLEO as AI shifts the satellite race from chips to networks
Starlink's massive scale in conventional low-Earth-orbit (LEO) satellites has markedly reinforced the satellite giant's aggressive grip on the commercial space industry for the next decade or so.
Friday 18 September 2026
GaN is winning the AI power argument, not yet the cost battle

Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage architectures are forcing suppliers to improve efficiency and power density. But despite rapidly expanding orders and falling costs, industry researchers say GaN remains at an early stage of adoption and is unlikely to displace silicon broadly for another two to three years.

Friday 18 September 2026
Huawei Connect 2026: Huawei scales supernodes into million-card AI systems

Huawei is extending its AI infrastructure strategy beyond individual accelerators and storage systems, unveiling an Agentic supercluster architecture designed to scale Ascend computing to as many as 1 million accelerator cards through UnifiedBus.

Friday 18 September 2026
Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push
Samsung Display (SDC) is reportedly preparing to invest about KRW 300 billion in a 12-inch RGB OLED-on-Silicon (OLEDoS) production line, moving the next-generation microdisplay technology closer to mass production as the XR market shifts toward lighter glasses.
Friday 18 September 2026
Z.ai's next growth engine starts where compute scarcity ends

Chinese AI developer Z.ai has raised its 2026 year-end annual recurring revenue (ARR) target by 25% to US$3 billion after fresh financing eased the computing bottleneck that had constrained growth earlier this year.

Friday 18 September 2026
CATL looks beyond China's passenger-car squeeze as electric trucks become the next growth front
The expansive reach of CATL's entrenched battery grip on the EV market has persisted through years of undefeated market share, pinning many Chinese automakers against severe component constraints that have proved difficult to break away from.
Friday 18 September 2026
Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event brought together Taiwan-based supply chain partners involved in civil, structural, and architectural (CSA) works; mechanical, electrical, and plumbing (MEP) systems; fab equipment; construction materials; and tool installation.

Friday 18 September 2026
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape

In response to rapid AI market growth, the Taoyuan City Government announced plans to establish a 40-hectare high-end integrated circuit (IC) substrate zone within Phase 1 of the Taoyuan Aerotropolis Industrial Area. Utilizing a phased construction and staggered site handover model to accelerate tenant entry, the city aims to begin joint land preparation with manufacturers in 2028, with options to scale the zone up to nearly 100 hectares based on industry demand.

Friday 18 September 2026
Taiwan prepares 150-qubit quantum computer RFP, seeks 'win-win' partnerships with global suppliers

Taiwan is moving closer to issuing a request for proposal (RFP) for its quantum computing system project.

Friday 18 September 2026
Taiwan's small businesses race into AI, raising the stakes for execution

Taiwan's small and medium-sized enterprises (SMEs) are making plans to adopt AI, according to a new survey that suggests the debate has shifted from whether to adopt AI to how quickly it can be turned into measurable business gains. The findings point to a new competitive divide shaped by decision speed, data readiness, and management execution.

Thursday 17 September 2026
AMD pivots to China developer ecosystems as Nvidia retreats

As Nvidia gradually retreats from China's high-end AI accelerator market amid strict US export controls, Advanced Micro Devices (AMD) is deepening its regional AI strategy. Rather than relying solely on traditional CPU and GPU sales, AMD is shifting its focus toward edge AI platforms, AI PCs, agent computers, local developer communities, and university partnerships.

Thursday 17 September 2026
Tier IV open-sources self-driving AI chip design to challenge Nvidia

Japanese autonomous driving developer Tier IV is developing an AI chip and will release its chip design and related toolchain as open source, allowing semiconductor manufacturers to use them to develop autonomous driving chips. The company aims to break Nvidia's dominant position in the autonomous driving chip market.

Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with a petabyte-scale key-value (KV) cache system designed for AI agents and long-context inference.