Chinese artificial intelligence developer Zhipu AI, also known as Z.ai, is narrowing the performance gap with leading US AI companies in cybersecurity-focused models, underscoring intensifying technological competition as Washington tightens oversight of advanced AI systems.
Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in memory prices makes it more profitable to squeeze output from existing production lines than to rush costly next-generation processes to market, The Bell reported on June 23.
LG Chem is discussing whether to expand production of copper-clad laminate, or CCL, a core material used in semiconductor packaging, as demand tied to artificial intelligence chips accelerates, Herald Business reported.
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNews and Yonhap reported.
