Sumitomo Chemical plans to begin mass production of a halide-based solid electrolyte in Japan as early as fiscal 2028, positioning the material as a potentially lower-cost option for all-solid-state batteries while seeking performance comparable with leading sulfide-based electrolytes, Nikkei reported.
China is dismantling the tax shelter that helped build the world's largest battery industry, and the move looks less like a one-off revenue measure than the opening of a broad campaign to force consolidation across its clean-energy supply chains — with consequences that reach from Chinese carmakers to global energy-storage buyers.
ASEAN's AI boom is taking on a dual role as both a "no-man's land" and an international hub from Singapore's perspective, while investors from the Middle East and China are also pushing into the region. According to industry sources, ASEAN's AI industry will be driven not only by local demand, but also by China's market.
The forthcoming AI dialogue between Washington and Beijing is less a sign of easing tensions than of a changing rivalry. Both governments are tightening their grip on frontier AI, extending competition beyond model development into the rules governing the technology.
LG Electronics plans to stop production at its Huizhou plant in China after October, ending manufacturing at the group's first production subsidiary in the country after more than three decades.
Chinese chip designer GigaDevice is investing another CNY500 million (approx. US$73.9 million) into its wholly owned subsidiary to support its DRAM research and industrialization project, continuing a series of capital injections aimed at expanding its memory business.
SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor site in New Albany, Ohio, denying a JoongAng Ilbo report that the companies were negotiating over the campus.
Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence Conference (WAIC) 2026, targeting the growing computing demands of large language models and AI agents.
