CleanMax's partnerships with Apple, Meta, and other technology companies highlight how artificial intelligence (AI) data centers are intensifying global demand for renewable power.

LG Electronics is expanding its artificial intelligence (AI) footprint on two fronts: in-house appliance chips and GPU compute services. On one hand, the company is scaling up the deployment of custom AI chips in its home appliances to boost product differentiation. On the other hand, PADO, a startup incubated and spun off by LG NOVA (LG's North American Innovation Center), is entering the GPU compute leasing and brokerage market to explore data center opportunities.

Oppo unveiled the international version of its Find X10 smartphone series in Spain on October 22 (Taiwan Standard Time), following the line's China launch in late September. The move marked the company's latest effort to strengthen premium smartphone shipments as competition intensifies and overall demand remains under pressure.

Taiwan and the UK deepened cooperation on offshore wind, carbon capture, and energy security at two bilateral meetings held recently in Taipei. The 21st Taiwan-UK Renewable Energy Exchange Conference brought together about 80 government, industry, and research representatives to discuss energy policy, technical practices, and collaboration on low-carbon technologies. The eighth Taiwan-UK Energy Dialogue Conference followed that afternoon.

China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research and manufacturing customer, marking a step forward in China's efforts to develop indigenous equipment for next-generation 3D chips.

Highlighting the deepening industrial synergies between Europe and Asia, the Egis Group TechDay Taiwan-France Strategic CPU Partnership Signing Ceremony hosted the official signing between Egis Group and SiPearl. The landmark ceremony unveiled a joint initiative to build a Mobius 100 CPU and UCIe chiplet-based marketplace, establishing a cooperative framework for sovereign AI and high-performance computing (HPC) data center infrastructure.

Level 3 (L3) autonomous driving penetration in China is forecast to exceed 35% by 2030, supported by falling sensor costs, advances in AI models, and tighter safety regulations. The forecast comes as the country expands autonomous driving trials and prepares for wider commercial deployment.

Unitree Robotics unveiled its new H2-X humanoid robot on October 21, showcasing martial arts combat, landings from height, and vehicle rescue as China's humanoid robot production accelerates. China's Ministry of Industry and Information Technology (MIIT) said humanoid robot output exceeded 40,000 units in 1H26 and is expected to surpass 100,000 units for the full year, signaling the industry's shift toward large-scale production and broader applications.

Japanese Prime Minister Sanae Takaichi will finalize a five-year plan by the end of 2026 outlining an investment blueprint for 17 strategic sectors. The plan will prioritize semiconductors and gaming for near-term investment, while physical AI and hydrogen are positioned as the next growth drivers.

Bear Robotics, the robotics subsidiary of LG Electronics, is adopting a dual-track production strategy by expanding outsourcing from South Korean partners to manufacturers in China. The move is aimed at supporting rising shipments and lowering manufacturing costs, with some robots made in China already shipped to the US.

Lam Research is grooming Indian companies to become its suppliers rather than relying only on its global vendor base, a senior executive said, as the US chip equipment maker deepens its presence in a market where the government now ties incentives to local sourcing.

China's smartphone market rebounded in September 2026 after weak July and August shipments, as brands rolled out more new models. Shipments reached 21.86 million units, down nearly 22% from a year earlier but up from a monthly average of about 17 million units over the previous two months, according to China Academy of Information and Communications Technology (CAICT) data cited by industry channel sources.

Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits while adding cost and complexity.

China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips. Montage Technology expects third-quarter 2026 profit to more than double on stronger DDR5 shipments, while Shenzhen-based Techwinsemi is developing Compute Express Link (CXL) memory expansion controllers. Together, these efforts highlight China's growing interest in AI server connectivity.