DIGITIMES news

Thursday 8 October 2026

Lisa Su takes AMD's Korea ties beyond memory to AI

AMD is broadening its Korean partnerships from memory procurement to AI infrastructure and research, as chief executive Lisa Su seeks the supply and technology cooperation needed for the company's planned 2027 expansion in chip shipments.

LG to test five commercial components in space aboard South Korea's fifth Nuri launch

Thursday 8 October 2026

AI PCs face memory squeeze as server demand takes priority

Thursday 8 October 2026

Samsung to exit in-house automotive AP, focus on high-margin chips

Thursday 8 October 2026

Fed could hike again before year-end as liquidity is watched

Thursday 8 October 2026

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Monday 12 October 2026

Moonshot AI's Hong Kong IPO faces a critical ownership dispute ahead of US$50 billion debut

China's Moonshot AI is seeking to settle a shareholder dispute involving claims potentially exceeding US$700 million ahead of a potential US$5 billion Hong Kong initial public offering (IPO). Allegations concerning asset transfers and corporate governance could complicate the AI startup's listing preparations.

Monday 12 October 2026

South Korea's Nucode targets US drone identification market with Realtek-based module

South Korean wireless communications module maker Nucode has signed a memorandum of understanding (MOU) with US drone identification and airspace intelligence provider Zing Drone Solutions to develop and supply electronic component modules for ultra-small and small-scale solutions. Nucode's NU87 module, which uses a Realtek chip, is among the products submitted for evaluation.

Monday 12 October 2026

Biren's BR20X GPU targets 1,024-chip AI systems, but US curbs cloud mass production

China's Biren Technology has successfully powered on its next-generation BR20X GPU, advancing to post-tapeout validation while preparing for customer sampling and mass production. The milestone advances its AI accelerator roadmap, though US export controls and manufacturing constraints remain major obstacles.

Monday 12 October 2026

Sumitomo Bakelite expands packaging material production across Singapore, China

Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This is expected to approximately double its production capacity for mold underfill (MUF) materials and approximately triple that for compression-molding granules.

Monday 12 October 2026

South Korean startup Helios targets Taiwan supply chains and Taiwan Strait risk analysis

As US defense procurement restrictions and European Union (EU) supply-chain due diligence requirements advance, South Korean risk-intelligence startup Helios is targeting verification needs in Taiwan and South Korea's AI, semiconductor, and defense industries. The company plans to bring public-information analysis and on-site verification services to Taiwan while strengthening maritime-threat analysis around the Taiwan Strait for corporate and national-security applications.

Monday 12 October 2026

AITO doubles down on CATL as China's battery supply chain shifts toward selective diversification

As efforts to curb CATL's dominance accelerate across China's automotive landscape, the domestic battery market is beginning to move away from single-supplier dependence and toward a more diversified sourcing model.

Monday 12 October 2026

Samsung could unseat SK Hynix as HBM leader in 2027

Samsung Electronics could overtake SK Hynix as the world's largest supplier of high-bandwidth memory (HBM) in 2027, as HBM4 prices climb and memory manufacturers compete for limited DRAM production capacity, according to forecasts presented at an October 6 semiconductor industry forum in Seoul.

Monday 12 October 2026

Cook makes first post-CEO visit to China, lauds Guangdong's role in Apple supply chain

Apple Executive Chairman Tim Cook made his first visit to China since stepping down as Apple CEO. He visited Guangdong Province, a manufacturing hub that contains much of the iPhone maker's supply chain ecosystem as it rolls out the iPhone 18 Pro series and its first foldable smartphones.

Monday 12 October 2026

Apple's iPhone 18 order cuts expose widening divide in premium demand

Apple's iPhone 18 Pro lineup is showing mixed demand signals weeks after launch. Reports of component order cuts suggest weaker-than-expected sales, while Chinese supply-chain sources point to stronger demand for the pricier Pro Max and foldable iPhone Duo. The divergence highlights growing pressure on Apple's premium strategy as rising memory costs drive smartphone prices higher.

Monday 12 October 2026

Rapidus targets customers underserved by TSMC, but can it convince them to take the risk?

Backed by US$15 billion in Japanese government funding, Rapidus announced an alliance with 17 semiconductor design-related companies, including US-based Synopsys and India's Infosys, on October 5. The partnership aims to expand its potential customer base by helping companies develop custom chips.

Monday 12 October 2026

India's festive smartphone sales may slow as memory costs lift prices

India's key festive smartphone season is set to matter far beyond its borders, as higher memory costs reshape pricing, buying habits, and brand competition in a major emerging market. Counterpoint Research expects unit sales to fall, even as market value rises, highlighting a global shift toward pricier, more selective device upgrades.

Monday 12 October 2026

SK Hynix's US$299 billion chip plan faces military base hurdle

SK Hynix's proposed KRW400 trillion (approx. US$299 billion) semiconductor expansion in southwestern South Korea faces a major obstacle as the company races to increase memory production capacity: the planned manufacturing site includes military facilities used by US forces, complicating construction timelines as competition intensifies with Micron Technology and Chinese chipmakers.

Monday 12 October 2026

Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang

PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial Park 3 (BKIP3) in Penang, Malaysia, and plans to create more than 1,000 jobs. Penang Chief Minister Kon Yeow Chow announced the investment on October 7, 2026.

Monday 12 October 2026

Samsung, SK Hynix accept ASML's 10% price hike in parts, report says

Samsung Electronics and SK Hynix have accepted a 10% increase in ASML's replacement-part prices for lithography systems in South Korea, with the higher rates taking effect for deliveries starting in January 2027, The Elec reported on October 11, citing industry sources.

Monday 12 October 2026

LG Display unveils maskless OLED technology, targeting more efficient IT displays

LG Display has unveiled a new organic light-emitting diode (OLED) manufacturing technology designed to improve production efficiency and display performance, and reduce manufacturing costs as it prepares to expand into the information technology display market.

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