VIA Mobile ITX form factor-based motherboard
VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification...
Photo: Ninelu Tu, DIGITIMES
With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward...
The Open Compute Project (OCP) is bringing together APAC communities for a very special two-day, in-person Summit to explore the many challenges and...
Humanoid robotics, 2025 - Market trends, critical components & strategic shifts
DIGITIMES believes that due to the high cost of hardware components, humanoid robots can hardly see rapid adoption across various...
Innolux deployments with Pioneer acquisition
Innolux to invest NT$33.7 billion to acquire Pioneer, a move driven by three key strategic initiatives to expand its automotive...
South Korea panel maker business status
South Korea's two major panel makers have made progress in restructuring their businesses and will continue to strengthen OLED...
