Transition to flip-chip and wafer bumping continues to build momentum
Slide from SEMICON West 2006 keynote given by Surfect Technologies CEO Steve Anderson.
Photo: Stephen Taylor, DigiTimes.com
Surfect Technologies CEO Steve Anderson delivers keynote at SEMICON West 2006
As miniaturization continues, the transition to flip-chip packaging and bumping continues...
Photo: Stephen Taylor, DigiTimes.com
As many countries are building up their semiconductor supply chains, Veolia Water Technologies, a global...
Apple CEO Tim Cook recently concluded his most extensive Southeast Asia tour in years, visiting Vietnam, Indonesia, and Singapore from April 15-19. During...
Samsung handset supply chain in northern Vietnam
Based on an observation of upstream suppliers and downstream customers of Samsung Electronics and its associated companies in...
Status of EV solid-state battery market
China, Japan and South Korea are all keen on pushing the development of solid-state batteries for EVs with volume production...
Samsung strategy and capacity deployment in India and Vietnam
Samsung has been pushing investments in Vietnam and India and is expected to continue doing so for the next several years as...
