Transition to flip-chip and wafer bumping continues to build momentum
Slide from SEMICON West 2006 keynote given by Surfect Technologies CEO Steve Anderson.
Photo: Stephen Taylor, DigiTimes.com
Surfect Technologies CEO Steve Anderson delivers keynote at SEMICON West 2006
As miniaturization continues, the transition to flip-chip packaging and bumping continues...
Photo: Stephen Taylor, DigiTimes.com
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