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Friday 7 June 2024
Google's AI laptop strategy: functionality and user experience over specs
PC industry players are eagerly anticipating the arrival of AI PCs to drive a new wave replacement cycle, with Microsoft defining specifications for AI PCs under the Copilot+ PC label that includes the integration of NPUs and chip capabilities reaching 40+ TOPS
Thursday 6 June 2024
Intel's Lunar Lake rescued by TSMC 3nm process?
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing AI PCs. This move raises questions about whether it is an attempt to repair the relationship with TSMC
Thursday 6 June 2024
How hard to snatch 2nm foundry orders from TSMC?
Semiconductor foundry companies have started to compete in the 2nm process shortly after their 3nm production lines started humming to mass produce for customers. There is something to learn from Samsung's 6-month lead to producing 3nm wafers with Gate-All-Around (GAA) architecture in June 2022
Wednesday 5 June 2024
For Big Fund Phase 3, the devil is in the funding structure details
The long-rumored third phase of China's national semiconductor fund, commonly known as "the Big Fund," has finally been officially announced. The fund scale of CNY344 billion (US$47.5 billion) makes it the largest funding project in China's chip history and far exceeds previous market expectations
Wednesday 5 June 2024
How Taiwan is related to Nvidia's rise to stardom in the AI Era
Nvidia, founded in 1993, has established itself as a leading player in the Graphics Processing Unit (GPU) market
Tuesday 4 June 2024
OwlTing CEO Interview: From Taiwanese blockchain startup to cross-border financial service provider
OwlTing, originally a Taiwanese startup using blockchain technologies for farm product resumes and hotelier payment systems, has made remarkable strides in transformation and acquisition and will start providing more cost-effective and faster cross-border financial services to Information Communications Technology (ICT) supply chains transitioning to the Americas
Monday 3 June 2024
Why China needs US$47.5 billion for Big Fund Phase 3 when chip oversupply is already a concern?
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU in Artificial Intelligence (AI) computing
Wednesday 29 May 2024
Semiconductor industry co-opetition between Taiwan and South Korea
The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported US$106 billion, raking in US$25 billion in trade surplus. For Taiwan, when there is a trade deficit, it only amounts to a fraction of its foreign reserve, but that would be a heavy burden to South Korea, which is already shouldering US$663.6 billion in foreign debt
Wednesday 29 May 2024
HBM memory sales to boost: Q&A with Micron CBO Sumit Sadana
Micron Technology's High-Bandwidth Memory (HBM) sales will climb to several hundred million US dollars in the current fiscal year and then to several billion US dollars in the next fiscal year, which begins in September 2024, according to company EVP and chief business officer Sumit Sadana
Tuesday 28 May 2024
China can break through US EUV ban with mature-node innovation, but how?
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon and SMIC
Monday 27 May 2024
Bolstering SDV: Q&A with Arm's APAC automotive partnership senior director Simon Teng
European, US, Japanese, and South Korean legacy automakers face challenges in developing Software-Defined Vehicles (SDV). Many have rebooted or given up their efforts
Monday 27 May 2024
Innovation vs. regulation: Taiwan struggles to balance AI legislation amid global scrutiny
As global AI regulations gain momentum, Taiwan—a key player in AI hardware—has yet to finalize its "Artificial Intelligence Basic Act.
Monday 27 May 2024
Will Chinese EV makers leverage declining sales to limit losses?
The cutthroat price competition in China in the past year has pressured many local automakers, resulting in significant losses. Some companies might have accepted their falling EV sales and withdrawn from the price war, a strategy to improve their losses
Monday 27 May 2024
Executive shake-ups at OpenAI and Amazon highlight shared challenges in balancing agility and stability
In recent days, both OpenAI and Amazon have seen significant changes in their senior leadership teams. While the reshuffling may seem coincidental, it highlights the similar challenges both companies face in balancing agility with maintaining a controversy-free image