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Friday 19 December 2025
Commentary: Why China's GPU start-ups command billion-dollar valuations despite losses
China's GPU start-ups are back at the center of a capital-market frenzy. Following Moore Threads, five-year-old MetaX has listed on Shanghai's STAR Market, with its shares surging more than sevenfold on debut. At its peak, the company's market capitalization briefly hit CNY330 billion (US$46.9 billion)—a striking number for a business generating just CNY1.5–2 billion in annual revenue, and one that would raise eyebrows even by global semiconductor standards
Friday 19 December 2025
Analysis: US leads AI in humanoid robots while China excels in cost and hardware
As humanoid robots emerge as a key technology riding the wave of AI, the US and China are rapidly forming two competing camps. Industry insiders analyzing their strengths say the US holds an edge mainly in software and foundational models, while China slightly outpaces the US in hardware innovation and iteration speed, with costs reportedly just one-fifth those of American products, making it difficult for other countries to catch up in the short term
Tuesday 16 December 2025
Commentary: Broadcom and MediaTek face profit challenges amid growing ASIC orders
Broadcom reported strong AI-related order growth but noted lower gross margins for ASIC products compared to non-AI items, causing market uncertainty about 2026 revenue. Industry experts explained that lower ASIC margins are common due to customer-driven design changes and production timing
Monday 15 December 2025
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA)
Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's leadership
Thursday 11 December 2025
Commentary: China's PCB edge survives G2 decoupling
As the US–China tech confrontation drags on, discussions consistently return to chips, semiconductors, rare earths, and tariffs. Despite accelerating supply-chain decoupling and overseas clients pushing for "Out-of-China" capacity, China remains the world's largest PCB manufacturing base and has fully captured both the volume and value gains from the AI server cycle. The country continues to demonstrate cost and efficiency advantages over production in Taiwan and Southeast Asia
Thursday 11 December 2025
Commentary: China's tech M&A unravels from EDA to compute
China's tech capital markets have slipped into a drawn-out, messy stretch, with multiple high-profile mergers either collapsing or failing to advance beyond early talks
Wednesday 10 December 2025
Micro LED's moment: Asia races to dominate the next display revolution
As display technology continues to advance, Micro LED has emerged as the next star after LCD and OLED—drawing intense interest and investment from panel makers worldwide
Tuesday 9 December 2025
Commentary: Are East Asia tensions a threat to supply chains?
The Indo-Pacific region has become the world's most critical theater for both technology manufacturing and geopolitical competition. As military tensions escalate across East Asia, executives are increasingly questioning whether their supply chains can withstand potential disruptions
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips. He also answered questions from domestic and foreign researchers about the US-China tech competition
Monday 8 December 2025
Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in 2024 to 53.4 million units in 2030. This data center AI chip category includes high-end and mid-range GPUs, application-specific AI chips (such as Google's TPUs), AI server CPUs, and networking/interconnect-related chips (e.g., Switch ASICs/rack-scale-up Interconnect Chips/DPUs & NICs)
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending Moore's Law amid its slowdown. He emphasized how these innovations enabled AI advancements and shaped TSMC's 3D Fabric platform despite early commercial challenges
Monday 8 December 2025
Commentary: Moore Threads' record IPO echoes Cambricon's trajectory as investors bet on unproven profitability
Chinese GPU startup Moore Threads debuted on the STAR Market on December 5, 2025, with its opening price soaring to CNY650 (US$91.94) per share—a staggering 468.78% increase—pushing its market capitalization beyond CNY300 billion at one point
Monday 8 December 2025
Research Insight: 800V systems, LiDAR, and multi-screen cabins dominate China's 2025 models
The 2025 Guangzhou International Automobile Exhibition concluded on Nov. 30, offering one of the clearest snapshots yet of where China's auto market is headed. After an on-site review of the show, DIGITIMES identified three defining trends for China's 2025 model-year vehicles: the rise of 800V high-voltage architectures, the rapid adoption of roof-mounted front LiDAR, and the emergence of multi-screen cabins. Together, these features are becoming essential for any carmaker hoping to compete in the world's largest auto market
Friday 5 December 2025
Commentary: Infineon-Innoscience GaN ruling delivers 'disputed victory' for both sides
The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that reveals the stakes of the dispute, both companies immediately declared victory