Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's leading packaging lead frame supplier, Chang Wah Technology, to see rising demand for high-end products in the second half of 2025. The company has also accelerated capacity expansion plans across Taiwan, China, and Malaysia

On December 30, Chinese AI company Z.ai launched a share sale to raise HK$4.35 billion (approx. US$560 million), aiming to become the first large language model (LLM) developer listed in Hong Kong amid a tech IPO surge, with a scheduled listing for January 8, 2026. Meanwhile, Z.ai has recently launched its latest open-source model, GLM-4.7, signaling a shift toward enterprise-focused AI and broader global adoption. As the company prepares for a 2026 IPO, the release highlights the growing influence of independent developers in a market increasingly shaped by hyperscale competitors and ecosystem distribution

J.K. Wang, a veteran leader in the semiconductor industry and former COO of TSMC, shared insights on TSMC's large-scale wafer fab mass production during his first media interview since retirement. Speaking on DIGITIMES' IC Broadcasting podcast, Wang highlighted how TSMC's success stems from meticulous teamwork rather than any single individual

Dublin-based semiconductor startup CHIPX plans to build an 8-inch gallium nitride on silicon carbide wafer fabrication plant in Malaysia to meet rising demand from artificial intelligence (AI) data centers and high-voltage power electronics, CEO and founder Chinmoy Baruah told DIGITIMES Asia. The project aims to establish a front-end manufacturing presence in Southeast Asia, with the company expecting to reach key milestones beginning in January 2026

Former COO of TSMC and a veteran semiconductor industry leader, J.K. Wang, shared insights from his 30-plus-year career at the company in an exclusive interview with DIGITIMES' IC Broadcasting podcast, marking his first media interview since retirement

Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA)

Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's leadership

Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending Moore's Law amid its slowdown. He emphasized how these innovations enabled AI advancements and shaped TSMC's 3D Fabric platform despite early commercial challenges

Qualcomm is hosting another summit with Taiwan's local PC ecosystem by the end of 2025, following its 2023 event. Kedar Kondap, Qualcomm's senior vice president responsible for PC and gaming computing divisions, delivered a keynote speech in Taiwan and spoke exclusively with DIGITIMES