Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA)

Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's leadership

Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending Moore's Law amid its slowdown. He emphasized how these innovations enabled AI advancements and shaped TSMC's 3D Fabric platform despite early commercial challenges

Qualcomm is hosting another summit with Taiwan's local PC ecosystem by the end of 2025, following its 2023 event. Kedar Kondap, Qualcomm's senior vice president responsible for PC and gaming computing divisions, delivered a keynote speech in Taiwan and spoke exclusively with DIGITIMES

Cybercriminal networks are evolving rapidly as artificial intelligence (AI) reshapes the landscape of cyber threats. Derek Manky, vice president of global threat intelligence at Fortinet, described the current phase as a third-generation cybercrime era marked by "AI-enabled scale." Unlike earlier attacks that used automated scripts to cast wide nets, today's cyber assaults employ AI to carry out highly tailored strikes against numerous victims simultaneously