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Ollie Chang, Taipei
Friday 12 September 2025
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting...
The 27th China International Optoelectronic Exposition (CIOE 2026) was held September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors...
Growth in low-Earth-orbit satellite communications accelerates; further boosts demand for GaN components
DIGITIMES has observed that since SpaceX began using reusable rockets for launch missions, its payload capacity has continued...
Winning the AI glasses race: Why myopia users and optical retailers hold key to mass adoption
AI glasses are emerging as a key gateway to AI; the market is projected to grow rapidly between 2026 and 2030, with a compound...
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
Mastering the 140%+ CAGR of CPO Semiconductor Revenue Explosion
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
CIOE 2026

