Analysis: Smartwatch demand set to outpace broader hardware market in 2026
1min ago in ICT
Uber expands ride-hailing reach across Taiwan as trips and local demand rise
4min ago in ICT
Yttek's ground equipment supports FORMOSAT-8 first satellite
5min ago in Aerospace
HTSI targets AI chip demand with SiPh, CPO, packaging push
5min ago in Semiconductors
Anthropic prepares IPO pitch centered on a $30 trillion AI market
5min ago in ICT
Proton sales jump 39% as Malaysian automaker expands EV push
6min ago in Electric Vehicles
Ablecom takes control of Jochu to expand AI server rack, liquid cooling business
6min ago in ICT
Commentary: Nvidia bets on open models to lift GPU usage
6min ago in ICT
Taiwan, Germany map AI-led net-zero push for 2026
7min ago in Sustainability
Taiwan plans higher power growth to meet AI demand, officials say
7min ago in Sustainability
AI data center boom lifts Weltrend fan-control chip sales 64%
7min ago in Semiconductors
Xiaomi's Xring O3, O100 and D100 define a three-tier AI chip strategy beyond smartphones
8min ago in Semiconductors
Nvidia shifts HBM4 mix toward 8-high as memory supply stays tight
8min ago in Semiconductors
China's foundries have won the mature-node argument, not the self-sufficiency one
8min ago in Semiconductors
Indian states begins to tighten screws on data centers even as the build-out accelerates
8min ago in ICT
5G-A low-latency breakthrough paves way for Physical AI, XR
8min ago in Communications
Ligitek skips 800G, targets 1.6T silicon photonics
10min ago in Semiconductors
Anthropic reportedly commits US$45 billion to Nscale for AI computing capacity
11min ago in ICT
Apple, Huawei foldables to collide in September, lifting ultra-thin glass, hinge and cooling demand
15min ago in Communications
Supply shortages, price hikes fail to slow new phone wave
18min ago in Communications
Samsung Galaxy A1 DDI packaging shifts to Chipbond
23min ago in Semiconductors
Lambda eyes US$3B funding ahead of 2027 IPO
31min ago in ICT
Goldman Sachs AI chief warns of cognitive decline
35min ago in ICT
SK Hynix questions PIM as heat and packaging emerge as HBM limits
Aug 26, 19:17 in Tomorrow's Headlines
Doosan develops 13µm ultra-thin CCL for memory chip substrates
Aug 26, 19:17 in Tomorrow's Headlines
2027 tri-fold phones enter a new phase as materials and durability become key battlegrounds
Aug 26, 19:16 in Tomorrow's Headlines