Catcher eyes cautious 1H26 amid memory and chip supply tightness
4min ago in ICT
South Korea signs MoU with Arm Holdings to establish 'Arm School' for IC design education
12min ago in Semiconductors
Tata Group and Intel form strategic alliance to assemble chips in India
1h 34min ago in Semiconductors
IBM to acquire Confluent for US$11 billion to expand real-time data and AI capabilities
1h 35min ago in ICT
Trump clears Nvidia's H200 shipments to China under new 25% revenue-share rule
1h 35min ago in Semiconductors
Zhen Ding projects strong revenue growth in 2026, expects doubling by 2027
1h 43min ago in Semiconductors
CyberTAN shifts 100% capacity to Vietnam and Wi-Fi 7
1h 44min ago in Communications
China's EMS giants pivot to robotics as global ODM/EMS rankings enter a new era
1h 44min ago in ICT
South Korea maps multi-layered EV strategy to secure production, revitalize supply chain, and boost tech edge
1h 45min ago in Electric Vehicles
Baidu evaluates Kunlun chip spin-off for Hong Kong IPO, but offers no guarantee
1h 45min ago in Semiconductors
Moore Threads CEO leverages Nvidia legacy to challenge GPU giant
1h 46min ago in Semiconductors
Taiwan drone giant pursues US$1 billion Pentagon drone contract
1h 47min ago in Aerospace
Taiwan FPC makers seek AI growth in wearables, high-speed transmission, and robotics
1h 47min ago in ICT
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
1h 48min ago in Semiconductors
Analysis: Why isn't Huawei trying to win the tech war?
1h 48min ago in ICT
Jahwa to expand actuator factory to meet Apple orders
Dec 8, 16:27 in Tomorrow's Headlines
China's AI chip market nears RMB 2 trillion with Cambrian and Hygon leading
Dec 8, 16:27 in Tomorrow's Headlines
Google TPU demand remains strong with 2026 production capped by CoWoS and memory bottlenecks
Dec 8, 16:27 in Tomorrow's Headlines
Commentary: How rising East Asia geopolitical tensions impact supply chains?
Dec 8, 16:27 in Tomorrow's Headlines
Chinese native GPU firms accelerate capital market entries amid AI chip race
Dec 8, 16:27 in Tomorrow's Headlines
SK Hynix to adopt hybrid bonding for 300-layer V10 NAND in 2027
Dec 8, 16:27 in Tomorrow's Headlines