India's fraud office seeks a Xiaomi probe as the market it once led shrinks around it
13min ago in ICT
China sets clear limits on payment terms to auto suppliers
13min ago in Electric Vehicles
DeepSeek reportedly advances Shanghai IPO plans as it cuts Flash model API prices
22min ago in ICT
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
23min ago in Semiconductors
Europe's BEV running costs now 33% below ICE
23min ago in Electric Vehicles
Hermes Testing ships membrane probe cards, targets SiPh and CPO
24min ago in Semiconductors
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
24min ago in Semiconductors
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens
24min ago in Semiconductors
Samsung SDS partners with OpenAI and Anthropic in AI push
24min ago in ICT
Powerlogic revenue rises for 3rd straight month on niche demand
24min ago in ICT
Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion
25min ago in ICT
DeepSeek's next AI test is not the model; it's everything around it
25min ago in ICT
Phison pushes in-house AI solutions as August revenue surges to record high
25min ago in ICT
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
25min ago in Semiconductors
Firmus, OpenAI strike compute deal for Malaysia AI factories
25min ago in ICT
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
25min ago in Semiconductors
Naver pitches a Europe-facing AI factory to France as Brookfield deal moves ahead
26min ago in ICT
Samsung SDS broadens AI push from software to factory robots
26min ago in ICT
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
26min ago in ICT
SK Hynix says 3D DRAM will borrow from logic foundry playbook
26min ago in Semiconductors
Korea puts KRW250 billion behind free national AI service as frontier-model fund takes shape
26min ago in ICT
China gets an early shot at the next SiC power-chip cycle
26min ago in Semiconductors
Beyond the stage, can XPeng's EV playbook scale humanoid robots?
27min ago in ICT
Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on
27min ago in Semiconductors
Samsung trims foundry partner network as remaining DSPs gain momentum
27min ago in Semiconductors
Cheap, energy-dense, difficult to tame: LG Energy Solution pushes LMR closer to EVs
27min ago in Electric Vehicles
CXMT's HBM3 yield reportedly stalls at 25% as TSV and stacking challenges expose China's AI memory gap
27min ago in Semiconductors
CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
28min ago in ICT
Apple's iPhone Duo raises the stakes for foldable smartphone cameras
28min ago in Communications
China's 6G race starts before the first 6G phone as satellite links move into the network core
29min ago in Communications
Wiwynn sees AI server shipments to overtake general-purpose servers in 3Q26
41min ago in ICT
Nanoimprint tools see a shift from round to square substrates
Sep 9, 18:45 in Tomorrow's Headlines
Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
Sep 9, 18:45 in Tomorrow's Headlines