Comments from readers
Press release; Meiling Chen, DIGITIMES Asia
Monday 14 September 2009
Add your comments
We have recently changed our search engine. Check the Advanced options to learn the new search rules.
- Musk says chip capacity will decide winner of AI race (Mar 21) - EE Times
- Google taps MediaTek for cheaper AI chips (Mar 17) - The Information
- European project gets $260 million for HPC chip sovereignty (Mar 6) - EE Times
- The trouble with MAGA's chipmaking dreams (Mar 3) - Economist
- Automotive chips: Gloom and doom or boom by 2030? (Feb 14) - EE Times
- Deepseek is more Wall Street than Silicon Valley (Feb 3) - Culpium, by Tim Culpan
- Tech CEOs try to reassure Wall Street after DeepSeek shock (Jan 30) - Wall Street Journal
- TSMC to make chips for cryptominer Bitdeer at new US fab (Jan 17) - Culpium, by Tim Culpan
![]()
Exclusive interview: Micron to capitalize on 2026 HBM market share, aggressively raises automotive memory pricesMemory giant Micron delivered strong financial results and expects the tight supply of DRAM and other...
![]()
50-50 production split proposal for TSMCAs a part of tariff negotiations, the Trump administration has pushed for a 50-50 split in chip manufacturing between the US and Taiwan, putting pressure...
Tech and deployment of China top-3 PSU players
The three major Chinese power supply manufacturers leverage local industry advantages and technologies, actively moving toward...
Fixed broadband market and tech development
Infrastructure policies and fiber/FWA drive global fixed broadband market growth; the US fixed-line broadband landscape is heading...
Status of LEO satellite communication market
The LEO satellite communications market reaches a turning point: Starlink takes the lead while telecom operators and the EU...
Posted on Sep 15, 07:19
This article is very misleading. The author is comparing apples to oranges. She is comparing Verizon's current technology(EV_DO Rev A) to AT&T's newest technology. She needs to compare AT&T's HSPA to Verizon's LTE network.