Samsung taps Japan for 3.xD chiplet push as packaging race heats up
1min ago in Semiconductors
GaN is winning the AI power argument, not yet the cost battle
1min ago in Semiconductors
Huawei Connect 2026: Huawei scales supernodes into million-card AI systems
3min ago in ICT
Samsung Display reportedly taps Sunic for KRW300 billion RGB OLEDoS push
3min ago in Displays
Z.ai's next growth engine starts where compute scarcity ends
3min ago in ICT
CATL looks beyond China's passenger-car squeeze as electric trucks become the next growth front
3min ago in Electric Vehicles
Micron holds Taiwan supplier conference with 84 companies
4min ago in Semiconductors
Nvidia roadmap shifts to rack-scale AI with Rubin Ultra
6min ago in ICT
FCS Group eyes North America layout, as plastics industry turns to material innovation
7min ago in ICT
AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
9min ago in Semiconductors
Taoyuan to sign high-end IC substrate MOU with Unimicron, Kinsus as Aerotropolis zone takes shape
10min ago in Semiconductors
Taiwan prepares 150-qubit quantum computer RFP, seeks 'win-win' partnerships with global suppliers
10min ago in ICT
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks
10min ago in ICT
Nan Ya accelerates AI materials shift with major capacity expansion
12min ago in ICT
Taiwan's small businesses race into AI, raising the stakes for execution
13min ago in ICT
Resonac develops 12-inch SiC substrate to target AI and EV demand
Sep 17, 18:14 in Tomorrow's Headlines
High-end GPUs may be slowing China’s AI compute expansion
Sep 17, 18:14 in Tomorrow's Headlines
2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
Sep 17, 18:14 in Tomorrow's Headlines
LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
Sep 17, 18:14 in Tomorrow's Headlines
Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
Sep 17, 18:14 in Tomorrow's Headlines