India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India, offering global customers broader access to custom silicon, ASSP products, and enhanced engineering and manufacturing resources, and accelerate deployment of advanced power management solutions across computing and industrial markets worldwide.
In a corporate filing, Cyient Semiconductors announced the close of its US$85 million majority-stake investment in Kinetic Technologies, a provider of power semiconductor solutions, in a deal intended to create a scaled semiconductor platform anchored in India with global reach. The acquisition brings Kinetic's revenue-generating business, more than 100 silicon-proven IPs, and over 250 high-volume custom and application-specific standard products across power management, protection, display power, and interface solutions into Cyient's portfolio.
Credit: Digitimes
The companies said the combined platform will integrate Cyient Semiconductors' spec-to-silicon engineering capabilities with Kinetic's established product portfolio and customer base, aiming to deliver immediate commercial scale in high-growth power semiconductor markets and address an estimated US$44 billion market opportunity in power and compute infrastructure. Kinetic Technologies will retain its current leadership and maintain continuity of engineering and customer teams, while benefiting from increased R&D investment and expanded global presence under Cyient's strategic oversight.
Cyient Semiconductors framed the transaction as a step toward building a differentiated, custom silicon and ASSP-led semiconductor engine from India to serve international markets. Company leaders noted the deal is intended to strengthen design resources, operational capabilities, and manufacturing in India, positioning the combined entity to advance intelligent power semiconductor solutions for computing and industrial applications and support India's semiconductor development objectives.
Credit: Digitimes
Article edited by Jack Wu
