Hanmi Semiconductor announced it will release a dedicated device called the "Wide TC Bonder" by the end of 2026, designed specifically for next-generation high-bandwidth memory (HBM). Industry sources expect this equipment to be officially adopted starting with the eighth-generation HBM5.
According to media outlets including The Chosun Daily and Seoul Economic Daily, Hanmi plans to supply the Wide TC Bonder to key customers from late 2026 for producing next-generation HBM.
Industry shifts focus to width over height
The memory industry has been actively seeking breakthrough technologies to address the challenges posed by increasing HBM capacity and speed. However, achieving more than 20 layers in high stacking technology has become significantly difficult. As a result, the sector is shifting focus toward developing "Wide HBM," which expands chip area instead of stacking higher.
By enlarging the HBM chip area, manufacturers can reliably increase the number of through-silicon vias (TSVs) and input/output (I/O) interfaces, as well as boost the count of micro bumps connecting DRAM chips to the interposer layer. This approach not only secures memory capacity and bandwidth but also facilitates better thermal management and energy efficiency compared to high stacking methods.
Enhanced bonding capabilities
Additionally, the Wide TC Bonder offers an optional fluxless bonding feature that eliminates the need to remove solder flux residues during processing. Compared to traditional techniques, this simplifies manufacturing, enhances bond strength, and further reduces HBM thickness.
Notably, Hanmi's design for the Wide TC Bonder features a distinctive celadon green color inspired by South Korea's Goryeo celadon pottery.
Hanmi stated it aims to lead the market by supplying the Wide TC Bonder equipped with new technology, helping customers strengthen their production competitiveness for next-generation HBM.
However, industry observers anticipate that introducing the Wide TC Bonder may delay Hanmi's original plans to deploy hybrid bonder equipment intended to support next-generation HBM high stacking production.
Article translated by Charlene Chen and edited by Jerry Chen
