The CPCA Show Plus 2025, one of Asia's largest printed circuit board (PCB) exhibitions, opened on October 28, 2025, in Shenzhen, drawing hundreds of global electronics manufacturers and suppliers.
As artificial intelligence (AI) reshapes the semiconductor and electronics landscape, exhibitors showcased a wave of high-end PCB technologies tailored for AI servers and high-performance computing (HPC). Leading Chinese PCB makers — including Shennan Circuits, Bomin Electronics, and Shenzhen Fastprint Circuit Tech — displayed 18-layer and higher multilayer boards, advanced HDI boards, and even ultra-high-density (UHD) prototypes designed for use in CoWoP advanced packaging technologies.
AI reshapes the electronics value chain
Speaking at the opening ceremony, You Lei, chairman of the China Printed Circuit Association (CPCA), said that AI's rapid expansion is driving semiconductor demand from the cloud to the edge, creating vast new opportunities across the electronics industry.
AI development is accelerating integration between high-performance computing, automotive electronics, and smart devices, he noted. To seize these opportunities, the entire supply chain — from materials to manufacturing — must strengthen cooperation and build a stable foundation for the AI era.
You also called for a more open and globally engaged Chinese electronics industry, urging deeper multilateral collaboration to ensure a secure, stable, and mutually beneficial global supply chain.
China's semiconductor drive gains ground
Representing the application side of the industry, Zhijian Wang, vice president of ZTE Corporation, told attendees that the global economy stands at the crossroads of structural transformation and technological disruption — with semiconductors now serving as the core engine of economic growth.
Industry forecasts suggest that by 2025, AI-related products will account for roughly 25% of the global semiconductor market, reshaping the entire ecosystem from IC design and wafer fabrication to advanced packaging and testing.
Wang noted that China's drive toward semiconductor self-sufficiency is making measurable progress: domestic equipment substitution has reached 21%, while key materials and advanced packaging have hit 28% and 35%, respectively.
He predicted that in 2025, China's semiconductor sector will achieve "three-dimensional breakthroughs" — in architectural innovation, market scale, and computing capacity — with companies like ZTE playing a pivotal role as both developer and consumer of AI chips and servers.
Celebrating China's top 100 electronics firms
The opening ceremony also featured the Top 100 Chinese electronics circuit enterprises awards. Honorees included Avary Holding, Victory Giant Technology, Dongshan Precision, Bomin Electronics, Shennan Circuits, Shengyi Technology, Shenzhen Fastprint, Aoshikang, Mingxing Electronic, Delton Technology, and Founder PCB.
Several Taiwanese suppliers were also recognized among upstream partners, such as Topoint Technology and Symtek Automation Asia (SAA), an automation equipment provider.
AI and innovation take center stage
According to CPCA, this year's exhibition brought together over 300 companies spanning the full electronics ecosystem — from PCB fabrication and semiconductor packaging to materials, equipment, and applications.
A new AI supply-chain pavilion and the top 100 enterprise zone were added this year, highlighting advances in high-density interconnect (HDI) components, ceramic substrates, optical modules, and semiconductor lithography materials.
The organizers said the initiative aims to tackle critical technical bottlenecks and strengthen collaboration across the electronics value chain as the industry races to meet surging global demand for AI-enabled hardware.
Article translated by Elaine Chen and edited by Jerry Chen
