ACE Solution, in collaboration with Taiwan Nano & Micro-Photonics, made a strong presence at SEMICON 2025, one of the world's most influential semiconductor exhibitions. ACE Solution showcased their latest semiconductor and silicon photonics solutions, featuring five key technologies: Silicon Photonics Sensing Platform, Silicon Photonics and Optical Communication Solutions, Teradyne Compound Semiconductor Test, TZ-6000 Non-Destructive Material and Wafer Inspection, and 3DIC Advanced Packaging Non-Destructive Inspection. Each demonstration received enthusiastic responses and attracted a wide range of industry professionals.
ACE Solution highlighted its core strength of "from materials to wafers to packaging," showcasing its deep expertise in testing and system integration. Quantifi Photonics, with its integrated opto-electrical testing system, enables ultra-high transmission speeds and reduced energy consumption, bridging groundbreaking research with efficient production testing.
In the fast-growing automotive and renewable energy industries, the Teradyne Compound Semiconductor Test system drew significant attention. As the industry's top power IC testing platform, it can achieve up to 6000V and 4000A, supporting testing needs for EV power systems, battery management, as well as Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules, power discrete, and mixed-signal devices.
In the field of material and wafer inspection, the TZ-6000 provides non-destructive quality measurement solutions. Leveraging terahertz (THz) technology, it achieves higher penetration depth for semiconductor wafer materials such as silicon, SiC, and GaN, and supports various sizes and shapes to ensure wafer quality. It enables comprehensive quality control for thickness, refractive index, resistivity, dielectric constant, localized surface/subsurface defects, and full-wafer scanning.
For 3DIC advanced packaging non-destructive inspection, the Electro-Optical Terahertz Pulse Reflectometer (EOTPR) stood out with its 5-micron precision positioning capability. It is the world's first instrument to use isolation technology for integrated circuit packaging fault analysis and quality monitoring, making it another highlight of the exhibition.
ACE Solution remains committed to a customer-centric approach, focusing on developing advanced testing technologies that deliver higher efficiency and lower power consumption. By addressing the rising demand in high-performance computing, electric vehicles, and AI applications, ACE Solution will continue to develop customized inspection solutions and deepen collaborations with global partners to drive innovation and sustainable growth in the semiconductor industry.
From left: Application Engineer Jacky Lee, Sales Manager Jason Hsieh, Marketing Specialist Mia Hung, Marketing Manager Jenny Lin, Senior System Integration Manager Leon Chang. ACE Solution
Article edited by Joseph Tsai