FOPLP progress is fastest in foundries, slower in testing and panel fabs

Rebecca Kuo, Taipei; Charlene Chen, DIGITIMES Asia Wednesday 10 September 2025 0

Laurent Giai-Miniet, CEO of ERS. Credit: DIGITIMES

Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision challenges and higher investments, slowing their progress.

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