Zhen Ding bullish on CoWoP despite long road to mass production

Flora Wang, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 13 August 2025 0

Credit: DIGITIMES

Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design replaces the conventional ABF substrate with a PCB board, potentially...

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