Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production

Chiang, Jen-Chieh, Taipei; Levi Li, DIGITIMES Asia Monday 14 July 2025 0

Credit: Kioxia

Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory production. This strategic shift moves the industry beyond the traditional...

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