ASE bets on new chip tech to handle AI’s rising power and speed needs

Flora Wang, Taipei; Jingyue Hsiao, DIGITIMES Asia Wednesday 4 June 2025 0

Credit: DIGITIMES

ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial intelligence (AI) and high-performance computing (HPC) applications...

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