Samsung reveals current situation and challenges of BSPDN, a key technology in the 2nm race

Daniel Chiang, Taipei; Jack Wu, DIGITIMES Asia 0

Credit: AFP

As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current development situation of its BSPDN technology as well. Besides emphasizing...

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