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ASE intros FOCoS-Bridge for AI and HPC chips

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia 0

Credit: DIGITIMES

Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm package containing two ASICs and eight HBM devices connected by eight...

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