MediaTek has expanded its Dimensity portfolio with its new Dimensity 9200+ chipset for flagship 5G smartphones. According to the chipmaker, the new offering builds on the success of its predecessor with a performance upgrade while maintaining power efficiency for longer battery life and better gaming experiences.
The Dimensity 9200+ chipset supports higher clock speeds than its predecessor, Dimensity 9200. It combines one ultra-core Arm Cortex-X3 operating at up to 3.35GHz, three Arm Cortex-A715 super-cores running up to 3.0GHz, and four Arm Cortex-A510 efficiency cores at 2.0GHz. To give the Dimensity 9200+ an additional boost for gaming and other compute-intensive applications, MediaTek boosted the chipset's Arm Immortalis-G715 GPU by 17%.
"We continue to raise the bar for flagship performance and power efficiency with the Dimensity 9200+, ensuring device makers have access to the most powerful mobile gaming features available today," said Dr. Yenchi Lee, deputy general manager of MediaTek's wireless communications business unit. "With faster raytracing and fluid gameplay at high frame rates, combined with MediaTek's power saving technologies, you can enjoy incredible visuals, epic effects and extended battery life."
The Dimensity 9200+ has a 4CC-CA 5G Release-16 modem that switches between long-reach sub-6GHz and super-fast mmWave connections. The chipset also supports Wi-Fi 7 2x2 + 2x2 with up to 6.5Gbps data rate, along with Bluetooth 5.3. MediaTek's Bluetooth and Wi-Fi coexistence technology allows Wi-Fi, Bluetooth low energy (LE) audio, and wireless peripherals to connect at the same time with extremely low latency and without inference.
Dimensity 9200+ is manufactured using the second generation of TSMC's 4nm process. Smartphones powered by the MediaTek Dimensity 9200+ are expected to be released in May 2023.