TSMC overview

Digitimes Research believes TSMC's planning in EUV lithography technologies, GAA transistor structure and semiconductor materials is what enables TSMC to make smooth progress and maintain its leading edge over the competition.

Apart from maintaining close collaborations with its customers, TSMC has been investing tens of billions of dollars every year and steadily increasing its R&D budget. This has helped TSMC build a solid technological foundation and capability, allowing it to keep pushing semiconductor process technologies forward.

Furthermore, TSMC's production provides economies of scale for it to grow its EUV lithography strength. Massive production experiences enable it to shorten the learning curve and boost EUV lithography equipment efficiency and yield.

• Introduction

• TSMC Capex and R&D

• Chart 1: TSMC capex and share in revenues, 2015-2023 (US$b)

• Chart 2: TSMC revenues and R&D expenses, 2015-2020 (US$b)

• EUV lithography technology

• Table 1: Advantages of TSMC EUV technology

• Learning curve

• Table 2: Comparison of advanced manufacturing process schedules between TSMC and Samsung, 2019-2022

• Transistor density

• Chart 3: Transistor density of manufacturing node by foundry (m units/mm^2)

• Transistor structure and new materials