Bits + chips
Semiconductor firms showcase innovations at Nepcon Japan 2020
Julian Ho, Tokyo; Joseph Tsai, DIGITIMES

Nepcon Japan 2020 runs from January 15-17 in Tokyo with exhibitors showcasing their latest IC innovations covering packaging technologies, materials, equipment, sensors and PCBs for applications including automotive electronics, new-energy cars and...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.