Bits + chips
Highlights of the day: TSMC extends 7nm production lead time
DIGITIMES staff

TSMC's clients reportedly have been eager to secure the foundry's 7nm production ccapacity, as strong demand from the smartphone and for the advanced node has resulted in tight supply with lead time extending. TSMC is expected to set aside more budgets for expanding capacity for its advanced proceees. GaAs foundry Win Semiconductors also plans to expand production capacity in the second quarter of 2020 to meet ever-increasing compound semiconductor foundry demand for 5G applications. For backend service firm ASE Technology Holding, it is ready to provide FO-AiP and FO-SiP packaging services to meet demand from the 5G sector.

TSMC 7nm production lead time extended: The lead time for production of 7nm chips at Taiwan Semiconductor Manufacturing Company (TSMC) has extended to nearly six months from the previous two months because of strong demand, according to industry sources.

Win Semi to expand GaAs wafer production capacity in 2Q20: GaAs foundry Win Semiconductors plans to expand production capacity by around 5,000 6-inch wafers monthly in the second quarter of 2020 to meet ever-increasing compound semiconductor foundry demand for 5G applications, according to company president Kyle Chen.

ASE gearing up for 5G mmWave AiP, RF modules: Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP) modules and RF(radio frequency) front-end modules (FEM) for use in 5G devices, according to industry sources.

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