Bits + chips
ASE gearing up for 5G mmWave AiP, RF modules assembling
Julian Ho, Taipei; Willis Ke, DIGITIMES

Leading IC backend house ASE Technology Holding will have its fan-out (FO) packaging technology ready in 2020 at the earliest for volume production of mmWave antenna-in-package (AiP) modules and RF (radio frequency) front-end modules (FEM) for use in...

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