中文網
Taipei
Thu, Sep 23, 2021
17:15
mostly clear
32°C
CONNECT WITH US
TSMC with EUV process gearing up for AI, 5G boom
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES 0

Chipmakers are expected to showcase their new-generation chip solutions for AI and 5G applications at the upcoming Mobile World Congress (MWC) trade fair, with Taiwan Semiconductor Manufacturing Company (TSMC) being their major foundry partner thanks...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories