TSMC with EUV process gearing up for AI, 5G boom

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Disconnected ICT Supply Chains: New Power Plays Unfolding

Bits + chips

TSMC with EUV process gearing up for AI, 5G boom

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES

Friday 22 February 2019

Chipmakers are expected to showcase their new-generation chip solutions for AI and 5G applications at the upcoming Mobile World Congress (MWC) trade fair, with Taiwan Semiconductor Manufacturing Company (TSMC) being their major foundry partner thanks...

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