TSMC with EUV process gearing up for AI, 5G boom

Taipei, Monday, November 18, 2019 09:38 (GMT+8),

22°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Positioned as LaaS provider�GQ&A with WPG CEO Frank Yeh

Bits + chips

TSMC with EUV process gearing up for AI, 5G boom

Monica Chen, Hsinchu; Jessie Shen, DIGITIMES

Friday 22 February 2019

Chipmakers are expected to showcase their new-generation chip solutions for AI and 5G applications at the upcoming Mobile World Congress (MWC) trade fair, with Taiwan Semiconductor Manufacturing Company (TSMC) being their major foundry partner thanks...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Global AIO PC shipment forecast and industry analysis, 2019
Global AIO PC shipments will continue shrinking in 2019.
Global server shipment forecast and industry analysis, 2019
For 2019, Taiwan-based server shipments will pick up another 7% on year.
Global AP demand forecast, 2017-2022
Worldwide shipments of smartphone application processors are expected to fall.

Digitimes Research Quarterly Data services

© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only