Bits + chips
ASE to expand WLCSP capacity at Singapore plant, sources say
Julian Ho, Singapore; Jessie Shen, DIGITIMES

In the wake of robust demand for wearable devices and automotive electronics applications, packaging and testing company Advanced Semiconductor Engineering (ASE) is set to expand wafer-level chip-scale-package (WLCSP) production capacity at its plant...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.