Chipbond grabs new gold bumping orders for power amplifiers, says report

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Chipbond grabs new gold bumping orders for power amplifiers, says report

Jessie Shen, DIGITIMES, Taipei

Monday 26 December 2016

Packaging and testing house Chipbond Technology reportedly has landed new orders for gold bumping for power amplifier (PA) components from Japan- and US-based vendors, according to a Chinese-language Commercial Times report.

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