ASE ready to enter volume production of fan-out wafer-level packaging
Julian Ho, Taipei; Jessie Shen, DIGITIMES
Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set to kick off by the end of 2016, according to industry sources.
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.