TI to open 300mm wafer bumping facility in Chengdu

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TI to open 300mm wafer bumping facility in Chengdu

Press release; Jessie Shen, DIGITIMES

Monday 10 November 2014

Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support...

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