TI to open 300mm wafer bumping facility in Chengdu

Taipei, Friday, February 21, 2020 18:33 (GMT+8),

19°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Asian Edge: On the Frontline of the ICT World

Bits + chips

TI to open 300mm wafer bumping facility in Chengdu

Press release; Jessie Shen, DIGITIMES

Monday 10 November 2014

Texas Instruments has announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Sponsored links

Mini/micro LED: Challenges and opportunities in the display industry
Mini LEDs and micro LEDs are expected to become improved backlighting solutions that can significantly enhance displays quality and create added value in the upcoming years.
Global server shipment forecast and industry analysis, 2020
Digitimes Research estimates that global server shipments moderately declined 1.4% in 2019 but will turn to show positive growth of 6.6% in 2020, totaling 16.01 million units.
Global mobile device shipment forecasts, 2019 and beyond: Smartphones, notebooks and tablets
Notebooks, smartphones and tablets are expected to see mixed shipment performances in 2019.

Digitimes Research Quarterly Data services

© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only