GloablFoundries will upgrade its 8-inch fab in Singapore to a 12-inch fab mainly by having equipment moved from a 12-inch fab in Taiwan that it acquired from Taiwan-based DRAM maker ProMOS Technologies in 2013, according to corporate senior vice president and Singapore operation general manager KC Ang.
GlobalFoundries' clients are tending to shift orders for LCD driver, power management and fingerprint recognition ICs from 8-inch foundry to 12-inch foundry production, Ang pointed out.
Through the upgrade, 12-inch and 8-inch annual capacities at the fab will have 1.0 million and 1.3 million wafers respectively, accounting for 60% and 40% respectively of total foundry capacity, Ang said. In addition, foundry processes at the fab will also be upgraded from 0.11-0.13 micron to 40nm, Ang indicated.
GlobalFoundries expects capital expenditure of US$10 billion in 2014 and 2015, Ang said.
In addition to the Singapore fab, GlobalFoundries' fab in Dresden, Germany, has a monthly foundry capacity of 50,000 wafers mainly based on 28nm technology and its fab in New York, the US, focuses on 20nm and 14nm processes.
Article translated by Adam Hwang
