Micron Technology announced introduction of its latest e-MMC embedded devices in 32GB of memory density, which are composed of 34nm multi-level cell (MLC) NAND flash chips. Customer samplings are expected in late August with mass production expected in the second half of 2008.
Micron highlighted that it greatly simplified its e-MMC system design by removing the requirements of the host memory controller to support NAND software drivers and complex NAND management techniques, including error correction code (ECC), wear leveling, and bad block management – replacing all of this complexity with a simple and ubiquitous MMC interface.
In addition to the impressive storage and feature options, Micron is providing e-MMC products qualified at extended temperatures, which makes them ideal for in-dash applications like navigation systems and other automotive applications that require a more robust operating range. Further, the JEDEC-standard interface minimizes the need for host software to accommodate process node migrations.
"Ultimately, because Micron manufactures NAND, we are able to capitalize on our outstanding process technology, well-established IP, and a deep commitment to forwarding NAND memory to bring products like this to market. In fact, we also have the capability to pair e-MMC devices with low-power DRAM in multi-chip packages (MCPs). Ultimately, our recent move to the 34nm process was a major accomplishment and these product lines directly benefit from that innovation," said Graham Robinson, director of segment marketing at Micron.