中文網
Taipei
Wed, Jan 19, 2022
12:49
light rain
17°C
CONNECT WITH US

Driver IC packaging providers to reach full capacity in 4Q

Ingrid Lee, Taipei; Rodney Chan, DIGITIMES 0

Packaging and testing houses, such as ChipMOS Technologies, International Semiconductor Technology (IST) and Chipbond Technology, are expected to reach full capacity in the fourth quarter amid the growing demand for driver ICs used in notebooks, monitors...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories