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Chang Wha to ramp up TCP and COF IC substrate capacity

Amy Lee, Taipei; Steve Shen, DIGITIMES Asia Monday 20 June 2005 0

Chang Wha Electromaterials (CWE) and its business partners will jointly invest NT$2 billion (US$64.5 million) to ramp up capacity of TCP-use (tape carrier package) and COF-use (chip on film) substrates, according to company sources.

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