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Winbond to start volume shipments of backend ICs for 2-megapixel camera phones in 3Q

Kathryn Chiu, Hsinchu; Jessie Shen, DIGITIMES Asia Wednesday 16 March 2005 0

Winbond Electronics expects to start volume shipments of backend ICs for 2-megapixel digital cameras used in mobile phones in the third quarter of this year, according to the company. Samples of the ICs have already been delivered for design-in.

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