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ChipMOS and affiliates to invest US$148 million for CMOS packaging and testing services

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia Friday 9 January 2004 0

ChipMOS Technologies and its affiliates will jointly invest NT$5 billion (US$148 million) to provide CMOS image sensor (CIS) and compact camera module (CCM) packaging and testing services, ChipMOS deputy chairman and CEO SJ Cheng said to the press after...

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