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Xintec to boost wafer-level CSP capacity to 13,000 by mid-2004

Amy Lee, Taipei; Jack Lu, DIGITIMES Asia 0

Xintec plans to increase its image sensor-use wafer-level chip scale packaging (WLCSP) capacity to 13,000 wafers per month by mid-2004, from about 8,000 wafers currently, according to a company source.

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