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SPIL teams with Ultratech, Xilinx to claim industry first in 12-inch bumping

Press release; Jane Wang, DIGITIMES Asia Wednesday 12 March 2003 0

Taiwan-based chip packager Siliconware Precision Industries Ltd (SPIL) announced on Tuesday that it was first in the industry to reach the “milestone” of processing 10,000 12-inch bump wafers.

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