ASE and SPIL to raise BGA packaging prices, say sources

Cage Chao, Taipei

Jul 14, 2003, 18:39 0

Due to the combining effect of rising BGA (ball-grid array) packaging demand and the traditional third-quarter high season, semiconductor assembly and test service (SATS) companies have seen substrate and solder ball supply tightening since the second quarter...

The article requires paid subscription. Subscribe Now

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.