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ACE: Wafer-level packaging and testing ready for take-off

Carol C.Y. Hsu, Hsinchu; Noah Sauve, DIGITIMES Asia Wednesday 29 August 2001 0

Advanced Chip Engineering Technology (ACE) has successfully run wafer-level packaging and testing for an 8-inch wafer of 64Mbit DRAM. The company has already acquired technical certification for its wafer-level processes and is now getting ready to...

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