CONNECT WITH US

ACE’s wafer-level packaging to enter volume production in fourth quarter

Amber Chiu, Taipei; Liu Yi-fang, DIGITIMES Asia 0

Advanced Chip Engineering (ACE), engaged in development of wafer-level packaging technology, noted that its 6-inch products will enter mass production this October. Since last November, it has broken even on its testing operation, which began last October...

The article requires paid subscription. Subscribe Now