Memory prices are soaring as much as four to five times year-over-year. PC brand vendors that were originally expected to gradually finalize supply contracts with memory makers by the end of the third quarter of 2025 have, as of year-end, not had a single contract fully signed. Suppliers are tight on supply and unwilling to sign, and prices are also lacking consensus. Memory makers still have capacity, but demand far exceeds supply. Therefore, brand vendors must rely on their own capabilities. In facing this tough situation, the supply chain reports that memory makers are giving priority to Apple, Lenovo, Asus, and Dell.

China is building tightly controlled AI systems using censored training data, political tests, and content tracking mechanisms, as part of its designation of AI as a key technology for its economy and national defense.

Tech giants, leading consumer electronics manufacturers, and optical component suppliers have all sought to gain an early edge in the rapidly growing field of smart glasses. Display technology advancements and integrated manufacturing processes are crucial to achieving success in the market.

Infineon is leveraging its technological strengths to expand into cutting-edge applications in AI data centers and robotics. The company is currently collaborating with Nvidia to develop power systems for next-generation AI racks, featuring direct current (DC) voltages up to 800V.

Global high-performance transmission cable maker Wonderful Hi Tech offered an optimistic outlook at its investor briefing on November 18, 2025. Despite a slight year-over-year revenue decline in the third quarter of 2025—attributed to the end of pre-stockpiling by clients ahead of tariff changes—company executives said the inventory adjustment is expected to conclude by year-end, setting the stage for a robust start to 2026. With continued growth in AI and low-Earth-orbit (LEO) satellite markets, the company anticipates 2026 will be a high-growth year.

The surge in AI-driven high-speed computing and data transmission demands has prompted major players to invest heavily in co-packaged optics (CPO) technology. Compound semiconductor firm IntelliEPI announced a share-swap partnership with optical communications company EZconn, drawing renewed market attention.

As generative AI and large language models scale rapidly, the computing race is shifting toward a quieter but decisive battleground: how data is stored, accessed, and utilized. According to Sina and Securities Times, Huawei has launched a global call for solutions through the sixth OlympusMons Awards, which opened on December 26, 2025. With a total prize pool of CNY3 million (US$426,000), the program seeks innovations aimed at overcoming storage and memory bottlenecks in the AI era.

ASIC design service and artificial intelligence (AI) software solution provider Microip announced on December 26, 2025, that its first self-developed near-field communication (NFC) transceiver IC has completed chip testing and verification, achieving a first-time right (FTR) initial test yield of as high as 99%.

The global unmanned vehicle market is booming with explosive growth. This surge has revitalized existing sectors while boosting related supply chains that are now targeting a second growth curve. Key component suppliers, such as those from the communication technology and IC design sector,s are seizing new business opportunities.

Nvidia has reportedly invested US$20 billion to acquire technology licenses from Groq, marking its largest investment to date. The move is drawing significant attention in South Korea as Groq is backed by Samsung Electronics and collaborates with it in the foundry sector.

Set-top box maker Skardin Industrial confirmed that it has recovered a portion of its bad debt from an Argentine client, recognizing approximately NT$110 million (US$3.5 million) in bad-debt reversal gains, which have significantly strengthened operating cash flow. The company plans to continue advancing its transformation strategy, focusing on green energy, internet data centers (IDC), and resilient communications modules as its next growth engines.