Ligitek is accelerating its move from LED packaging into silicon photonics (SiPh) and high-speed optical communications, with 1.6T product samples already tested and volume-production equipment due from late 2026 through the first quarter of 2027. Chairman I-hsin Tung said recent optical throughput tests exceeded industry benchmarks, with revenue contribution expected in the second half of 2027.

Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift is increasing the need for metrology, inspection, and failure analysis, and Zeiss is planning a semiconductor innovation center in northern Taiwan to support validation and application development.

Samsung Electronics launched its new Galaxy Z series foldable smartphones, including its first wide-folding model, kicking off this year's foldable smartphone battle. With attention on the upcoming release of Apple's debut foldable smartphone, the market reported on September 2 that Xiaomi and Huawei will unveil new foldables on September 7, ahead of Apple.

Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies at Semicon Taiwan 2026. The applications include full-wafer warpage detection inside front-opening unified pods (FOUP)/cassettes and through-glass via (TGV) aperture defect inspection technology, aimed at preventing equipment downtime during manufacturing processes and ensuring the yield and quality of next-generation advanced packaging.

Taiwanese compound semiconductor maker WIN Semiconductors said on September 1, 2026, that compound semiconductors are the backbone of AI and satellite communications, as it unveiled 0.1μm GaN technology aimed at higher-speed transmission. Senior associate vice president Chuck Huang made the remarks at the NExT Forum.

As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in AI performance may depend as much on manufacturing breakthroughs as on chip design, with supply chains and costs likely to change.

Google will expand its AI infrastructure research and development center in Taipei's Shilin district, adding 60% more office space, as it deepens work with Taiwan's supply chain on next-generation computing. The move underscores Taiwan's growing role in global AI development, where chip, cooling, and data-center advances affect users worldwide.

Broadcom used its third-quarter fiscal 2026 earnings call on September 2 to convert a quarter-by-quarter AI story into a dated, customer-by-customer deployment schedule running into fiscal 2029. Chief executive Hock Tan told analysts that across the company's six XPU customers there is demand for 30GW of accelerated compute in fiscal 2027 and 2028 combined, and that Broadcom expects to ship "US$350 billion of AI semiconductors to these customers in the next two years." He was explicit that not all 30GW will come online inside those two fiscal years — "we judge it conservatively to be somewhat less" — and that the revenue figures, not the gigawatt figures, are the commitment.

AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility into 2027.

The most consequential figures on HPE's fiscal third-quarter earnings call on September 2 were not the results but the commitments standing behind them. According to Bloomberg's transcript of the call, the company has more than doubled its networking purchase commitments in a single quarter, carried US$11.8 billion of inventory into the fourth quarter, and signed multi-year supply agreements locking component capacity it can reallocate every 90 days. With two newly disclosed anchor deals, that pre-buying is what underwrites the roughly US$4 billion added to the fiscal 2027 revenue framework over the past quarter.

Hewlett Packard Enterprise's fiscal third-quarter results, reported on September 2, are the point at which the Juniper Networks deal and the enterprise AI cycle stopped being a cost story and became a margin story. Revenue reached US$12.2 billion in the three months to July 31, up 34% from a year earlier, and GAAP operating margin widened to 11.4% from 2.7%. What now limits the business is neither demand nor integration. It is component supply.